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New Book Discusses Low-Power Design for ASICs

eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced that An ASIC Low-Power Primer is now available from Springer, a leading publisher of science and technology reference books. Written by eSilicon engineers Dr. J. Bhasker, architect, and Dr. Rakesh Chadha, director of design technology, the book provides an invaluable primer on the techniques utilized in the design of low-power digital semiconductor devices.

6 Feb 2013

Desktop Galvo Fiber Laser Welding System To Be Showcased At MD&M West By Miyachi Unitek

Miyachi Unitek Corporation, a leading manufacturer of welding equipment and laser processing systems, announces a number of new product innovations to be highlighted at the Medical Design & Manufacturing (MD&M) W...

6 Feb 2013

Industrial Low Light Applications For Ultra Compact VS7000 CCD-HS

HORIBA Scientific, global leader in OEM Grating and Spectrometer systems, is announcing its new VS7000-CCD-HS (High Speed) Mini CCD Spectrometer. This fast Mini-CCD Spectrometer outperforms most front-illum...

From HORIBA 6 Feb 2013

Thin Film Deposition Patent For Oxford Instruments

Oxford Instruments, a leading provider of tools and equipment for industry and research, has been granted a patent in the area of high density plasma assisted thin film deposition.

From Oxford Instruments Semiconductor 5 Feb 2013

Comprehensive Guide To Eco-efficient Concrete

Eco-efficient concrete from Woodhead Publishing is a comprehensive guide to the characteristics and environmental performance of key concrete types. Part one discusses the eco-efficiency and life cycle assessment ...

5 Feb 2013

Effective Deicing of Runways and Roads with Environmentally Friendly Formic Acid

Formic acid enables environmentally friendly deicing of runways and roads – and is successful in many other applications

From BASF Corporation 5 Feb 2013

New Silicone-Based Flexible Polymer Material for Optical Waveguides Unveiled at Photonics West Conference

Today at the Photonics West conference, Dow Corning and IBM scientists unveiled a major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers. This new silicone-based material offers better physical properties, including robustness and flexibility, making it ideal for applications in Big Data and for the development of future exascale computers, which are capable of performing a billion billion computations per second.

From Dow Corning 5 Feb 2013

Minerals Technologies to Provide Fulfill High-Filler Technology to Major North American Paper Company

Minerals Technologies Inc., announced today that it has signed a commercial agreement with a major North American paper company to provide Fulfill(TM) E-325, a new, high-filler technology, at a paper mill in the United States. This is the company's second commercial agreement with a North American papermaker.

From Minerals Technologies Inc. 5 Feb 2013

Orbite and Veolia Partner to Recycle Caustic Waste Red Mud from Alumina Production

Orbite Aluminae Inc. ("Orbite") and Veolia Environmental Services ("Veolia") signed an exclusive worldwide collaborative agreement for the treatment and recycling of red mud generated by industrial alumina production using the Bayer process. The terms of the partnership include the construction of the first plant to treat red mud using Orbite's patented process.

5 Feb 2013

TI Introduces Single-Chip, Front-End PMU for ARM Cortex Based Battery-Powered Applications

Texas Instruments Incorporated (TI) today introduced the industry's first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex A9 and A15 processors.

5 Feb 2013

FDA Approves K7C Polyetheretherketone-Based Spinal Fusion Medical Device

K7 LLC’s K7C™ Cervical Spacer, a spinal implant device using Evonik’s VESTAKEEP® PEEK (polyetheretherketone), has received the U.S. Food and Drug Administration’s (FDA) 510(k) approval for use as an Intervertebral Body Fusion (IBF) device.

5 Feb 2013

AVX Develops High-Voltage Radial Leaded MLC Capacitors for Automotive Applications

AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, has developed a unique new series of high-voltage, conformally coated, radial leaded MLC capacitors for automotive applications.

5 Feb 2013

Soitec’s Engineered Substrates Widely Used in Mobile Communications

Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has estimated that its engineered substrates used in manufacturing semiconductors for mobile communications are incorporated in at least 50 percent of smart phones and internet-connected tablet computers being produced today.

5 Feb 2013

HLP Klearfold Acquires ASG’s InSight Visual Packaging System Patents

HLP Klearfold recently purchased the worldwide patents for the InSight visual packaging system from ASG (the AGI Shorewood Group), with whom they previously had an agreement to license InSight. The award-winning system combines printed plastic sleeves and injection molded plastic end caps to produce a very distinctive visual package.

5 Feb 2013

Zircotec's Ceramic Based Composites Coating Material Debuts on Aston Martin's One-77

The ceramic based material that originally allowed F1 teams to exploit the 'blown diffuser' aerodynamic advantage has made its road car debut on Aston Martin's One-77. Developed by Oxfordshire-based Zircotec, the ThermoHold� for composites material is applied to both the car's diffuser and underbonnet air intakes, enabling Aston Martin's designers to specify lightweight and aesthetic materials for high temperature environments.

From Zircotec 5 Feb 2013

Materials Science News

New Book Discusses Low-Power Design for ASICs

Desktop Galvo Fiber Laser Welding System To Be Showcased At MD&M West By Miyachi Unitek

Industrial Low Light Applications For Ultra Compact VS7000 CCD-HS

Thin Film Deposition Patent For Oxford Instruments

Comprehensive Guide To Eco-efficient Concrete

Effective Deicing of Runways and Roads with Environmentally Friendly Formic Acid

New Silicone-Based Flexible Polymer Material for Optical Waveguides Unveiled at Photonics West Conference

Minerals Technologies to Provide Fulfill High-Filler Technology to Major North American Paper Company

Orbite and Veolia Partner to Recycle Caustic Waste Red Mud from Alumina Production

TI Introduces Single-Chip, Front-End PMU for ARM Cortex Based Battery-Powered Applications

FDA Approves K7C Polyetheretherketone-Based Spinal Fusion Medical Device

AVX Develops High-Voltage Radial Leaded MLC Capacitors for Automotive Applications

Soitec’s Engineered Substrates Widely Used in Mobile Communications

HLP Klearfold Acquires ASG’s InSight Visual Packaging System Patents

Zircotec's Ceramic Based Composites Coating Material Debuts on Aston Martin's One-77

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