Scientists working at GE’s Global Research Center of GE declared that they have developed a prototype substrate that can prevent heat build-up in electronic devices such as laptop and can cool them down better than copper.
Use of copper has been favored in electronic devices because of its faster heat conducting attributes. The electronic systems that use advanced features produce more heat, which at times restricts the functioning of the systems, affecting the speed and processing power of the systems.
The new phase-change based model substrate can be used on computer chips and on assorted types of electronic components. The substrate functions as a cooling mechanism by dissipating the heat produced from the electronic systems and maintaining the components of the system cool.
In a test performed at the Air force Research laboratories, the research team has productively proved that the prototype substrate with one-fourth weight of a copper provides twice the cooling capability than copper and successfully functioned in over 10 times normal gravity condition.
The prototype substrate, with features such as low weight, high level thermal conductivity and high level “G” acceleration functioning, could perform productively in an assorted range of systems such as laptop and complex computing systems that manage the airplane and electronic control systems on aircrafts and jetliners.
Source: http://ge.geglobalresearch.com/