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PolyOne Plans to Open New Plant in South Africa

PolyOne Plans to Open New Plant in South Africa

PPG Signs Licensing Agreement with Henan Billions for Titanium Dioxide Technology

PPG Signs Licensing Agreement with Henan Billions for Titanium Dioxide Technology

SEHO to Showcase PowerSelective Soldering System at 2012 SMTA Ohio Valley Expo

SEHO to Showcase PowerSelective Soldering System at 2012 SMTA Ohio Valley Expo

Techcon Introduces 32-Pitch TS7000 Model Series for Microdot Dispensing

Techcon Introduces 32-Pitch TS7000 Model Series for Microdot Dispensing

Understanding Protein Crystallization Growth at the University of Leeds using a Temperature Stage from Linkam Scientific Instruments

Understanding Protein Crystallization Growth at the University of Leeds using a Temperature Stage from Linkam Scientific Instruments

Vishay Introduces New Surface-Mount Multilayer Ceramic Capacitors

Vishay Introduces New Surface-Mount Multilayer Ceramic Capacitors

KEMET Unveils T550 Polymer Hermetic Seal Capacitor Series

KEMET Unveils T550 Polymer Hermetic Seal Capacitor Series

Magnetism May Enable Superconductivity in Iron-Based Materials

Magnetism May Enable Superconductivity in Iron-Based Materials

ExxonMobil Chemical and SABIC Partner for Elastomers Project in Saudi Arabia

ExxonMobil Chemical and SABIC Partner for Elastomers Project in Saudi Arabia

New R+D Center at ORNL Enables Development of Advanced Automotive Battery

New R+D Center at ORNL Enables Development of Advanced Automotive Battery

HORN Establishes Composites + Fabrication Materials Focused Business Unit

HORN Establishes Composites + Fabrication Materials Focused Business Unit

Five Solar Device Makers Award R+D Assignments to Natcore

Five Solar Device Makers Award R+D Assignments to Natcore

Intertronics Launches Fisnar QuantX Fluid Dispensing System

Intertronics Launches Fisnar QuantX Fluid Dispensing System

SAE International, CMH-17 Organization Ink Deal to Publish Composite Materials Handbook

SAE International, CMH-17 Organization Ink Deal to Publish Composite Materials Handbook

SUSS and Dow Corning Partner on Temporary Bonding Materials for Semiconductor Packaging

SUSS and Dow Corning Partner on Temporary Bonding Materials for Semiconductor Packaging

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