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ASMC 2019 Highlights Latest Advanced Manufacturing Strategies

Celebrating its 30th anniversary, the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) kicks off today with more than 300 industry experts and executives delivering more than 30 hours of technical presentations on the latest advanced manufacturing strategies and methodologies.

7 May 2019

iwis VP8 FoodPlus Spray

Following the proven success of its VP6 Kombi Superplus Spray for industrial chain applications, drive systems supplier iwis antriebssysteme GmbH & Co. KG has launched another innovative product: VP8 FoodPlus Spray.

From iwis 7 May 2019

Husky Launches Next Generation Molding Solution for Better Energy Savings

Husky Injection Molding Systems has announced the launch of its next generation HyPET™ HPP5e system.

From Husky Injection Molding Systems Ltd 6 May 2019

UPM Develops Large Scale Robot-based 3D Printing Applications Using PLA Biocomposite

In collaboration with ABB and Prenta, UPM has demonstrated large scale robot-based granulate 3D printing applications with UPM Formi 3D biocomposite opening new possibilities for designers and manufacturers.

From UPM 6 May 2019

BTU Delivers 5th PYRAMAX Reflow Oven to TKT Electronics in Denmark

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that TKT Electronics has installed its fifth PYRAMAX™ reflow oven.

From BTU International 6 May 2019

MODI and VisiConsult Present New Product Cooperation at SMTconnect in Nuremberg

Over the past few months, MODI and VisiConsult have been working together to come up with a solution for their customers: fully automatic text recognition for databases and test counting of parts in one. The result will be presented for the first time at SMTconnect expo in Nuremberg.

From MODI Modular Digits GmbH 6 May 2019

Binding Hydrogen Atoms with Graphene to Make it into a Useful Semiconductor

Graphene is well known as an amazing material. It comprises of pure carbon, with a thickness of only a single atomic layer. Although it is very strong, stable, as well as conductive, when it comes to electronic devices, it still has major demerits.

6 May 2019

Komatsu America Corp. Introduces the New PC1250SP-11 and PC1250LC-11 Hydraulic Excavators

Komatsu America Corp., a leading global heavy equipment manufacturer, introduced the new PC1250SP-11 and PC1250LC-11 Tier 4 final emissions certified hydraulic excavators.

From Komatsu America Corp. 6 May 2019

The MX400 - LECO’s Next Generation of Mounting Press

As the newest mounting press to enter LECO’s lineup of metallographic instrumentation, the MX400 will streamline sample preparation with its exceptional ease-of-use and dual mount capability in a fully automated solution.

From LECO Corporation 6 May 2019

Webinar - Working with Powders – How Comprehensive Characterisation can Optimise Your Process

Freeman Technology, the powder flow specialists, will be hosting a free webinar ‘Working with Powders – How Comprehensive Characterisation can Optimise your Process’ on May 29 at 15.00 (BST).

From Malvern Panalytical 4 May 2019

Researchers Discover the Potential of Bismuth Ferrite to Store Information on a Computer Using Electricity

Study into a potential class of materials by scientists at the University of Arkansas could lead to more inexpensive and faster computer memory.

3 May 2019

Adaptive3D™ Partners with Chemence to Fulfill Accelerated Growth Schedule

Adaptive3D™ Technologies and Chemence jointly announced a partnership agreement today to support Adaptive3D's accelerated growth schedule in additive manufacturing and specialty materials.

From Adaptive3D Technologies 3 May 2019

3D-Printed Biocompatible Tissue Scaffolds can Help Replace Irreparably Damaged Tissue

It is said that the future of medicine will be biological, and researchers are hoping that 3D-printed biologically functional tissue would soon be used to substitute the body’s permanently damaged tissue.

3 May 2019