Solder Reflow Services from Digicom
This video describes Digicom’s solder reflow services. The advanced high-throughput convection reflow oven from Digicom produces customized time-temperature profiles for each board. A gold super-mold module connected to the PCB travels through the reflow oven collecting data on thermal characteristics. Data is recorded at a maximum rate of 5,500 points per second using sensors attached to the PCB, and is then transferred to an on-board computer. Complex algorithms and related software take into account the solder paste characteristics, sensor readings, and other variables relevant to each assembly. Thus, a target profile is created and set-points are transferred to the oven configuration.
Digicom's convection oven optimizes both lead-free and leaded processing, even for high density boards so as to give maximum efficiency and productivity. The oven has closed-loop convection control that provides precise heating and cooling, reduced nitrogen consumption, and programmable heat transfer. Long multiple heating and cooling zones facilitate smooth and precise profiling and an exit temperature below 80 °C. Powerful analytical capabilities and excellent profile control allow Digicom to provide exacting reflow process with the highest quality.
Run Time - 1:41min