Posted in | Materials Processing

Burn-in Test from Digicom Electronics

This video provides a brief idea about the burn-in test used at Digicom. The burn-in test is used to stress check the finished board assemblies for identifying any signs of possible failures. The test is done before the board is mounted onto the final assembly or dispatched to the client. Multiple ramp-ups to maximum temperatures and extreme conditions are involved in the burn-in test to expose dry solder joints or weak parts.

Run Time - 0:36min

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