Rehm Thermal Systems, a provider of drying and soldering systems, has announced that the company has chosen Viscom’s X8011 X-ray system.
By Dr. Cameron Chai
23 May 2012
ACD, a provider of physical design, printed circuit board (PCB) fabrication, parts procurement, assembly and test services for the electronics industry, has added a PDR IR-E3 Evolution 2000 BGA Rework System to its portfolio.
By Nick Gilbert
23 May 2012
Shocking Technologies, which develops innovative polymer nanocomposite material named as the Voltage Switchable Dielectric (VSD) material to protect electronic products against electrostatic discharge (ESD), has amassed $10.5 million.
By Nick Gilbert
23 May 2012
Industrial Nanotech, a provider of nanoscience-based sustainable and energy-saving solutions, has announced the completion of initial installations of its Nansulate thermal insulation and protective coatings at the facilities of numerous key US textile and paper manufacturers to enable surface protection, insulation and personnel protection.
By G.P. Thomas
23 May 2012
Abakan’s company, Powdermet has reported significant developments in the commercialization of MComP nanocomposite metals and become a part of a joint venture development team, consisting of the University of Wisconsin-Madison, Eck Industries and Oshkosh, to advance nanostructured high-strength light-weight metals.
sp3 Diamond Technologies, a provider of diamond-based solutions, has reported the shipment of its Model 655D Series hot filament (HF) chemical vapor deposition (CVD) diamond reactor system to the Marvell Nanofabrication Laboratory of the University of California, Berkeley (UC Berkeley).
By Nick Gilbert
23 May 2012
Researchers from the California NanoSystems Institute (CNSI) at UCLA and the UCLA Department of Chemistry and Biochemistryhave developed a way to stabilize proteins using polymers.
By Dr. Cameron Chai
23 May 2012
Georgia Gulf, an integrated North American manufacturer of chlorovinyls and aromatics, as well as vinyl-based building and home improvement products, has signed a collaborative agreement with Segetis, a technology-enabled green chemistry company, to develop a new flexible vinyl compound using Segetis’ specialty bio-plasticizers.
By G.P. Thomas
23 May 2012
THERCOBOND, a new line of highly thermally-conductive bonding and printed materials, has been launched by Applied Nanotech, a nanotechnology company. The materials are mainly designed for applications in photonics and power electronics.
By Nick Gilbert
23 May 2012
Novelis, a manufacturer of rolled aluminum, has reported that the 2012 Mercedes-Benz SL introduced newly, features the company’s aluminum material. The latest model of Mercedes is probably the first full-production vehicle of the company to have an aluminum structure.
Dow Corning has announced that the company will exhibit its effective silicone-based solutions at the CHINACOAT 2012 Chengdu Conference. This program will be held from 7 to 8 June, 2012. These silicone-based solutions can be used in solvent-based and waterborne coatings, inks and paints.
The Xflow series from Zwick Roell of extrusion plastometers introduced last year by Zwick/Roell AG, a worldwide leader in materials and component testing solutions, has received a strong market response across a wide ran...
From red carpet dresses made from recycled bottles to biodegradable packaging made from plants, innovations in polymer technology are everywhere, powered by new analytical systems that generate the detailed information needed to tailor performance.
Umeco is an acknowledged pioneer and market leader in Out-of-Autoclave (OoA) curing prepreg systems, widely used to manufacture primary and secondary structures for civil and military aircraft.
OoA processing can off...
Thermo Fisher Scientific Inc., the world leader in serving science, has announced the launch of the Thermo Scientific Exactive Plus system, the company’s latest benchtop liquid chromatography-mass spectrometry (LC-MS) system for high-throughput screening, identification and quantification of compounds in complex matrices.