The PECS III system is designed to provide consistent, high-quality surfaces across multiple sectors in a single, simple process.
Advantages
The PECS™ III is a broad-beam argon-ion milling system that produces consistent, high-quality surfaces across semiconductors, batteries, and advanced materials through a single integrated process. It offers accurate surface preparation of complicated, multi-material samples while minimizing operator reliance and preparation-induced artifacts.
- Consistent, high-quality surfaces: Produces consistent, low-damage surfaces ideal for rigorous analytical procedures on a variety of materials
- High throughput for complex materials: Milling rates are increased by 4.4 times, and larger areas can be prepared for faster, more substantial outcomes
- Up to seven times wider cross-section capability: Produces large area cross-sections with ease, supporting semiconductor, battery, and multi-layer systems
- Universal, simple preparation across diverse materials: Provides predictable, consistent results regardless of operator expertise, eliminating rework and preparation variability
- Streamlined workflow: Delivers results through a single preparation procedure, decreasing handling stages and increasing overall efficiency
- Integrated coating functionality: Deposits consistently thin coatings to protect sample surfaces and allow for the investigation of fragile and non-conductive materials