Posted in | Materials Processing

MicroSense UltraMap 200C Wafer Thickness Measurement System

The MicroSense UltraMap-200C is an automated wafer metrology system designed for high throughput measurement of wafer thickness, flatness, bow and warp.

The system features a proprietary dual probe capacitive sensor measurement system resulting in unsurpassed measurement repeatability with high wafer throughput.

Measure wafers up to 200 mm in diameter, including sapphire, silicon carbide and other semiconductor wafer materials.

MicroSense UltraMap 200C Wafer Thickness Measurement System

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