Sample Preparation Systems from Leica - The TXP and TIC 3X

Leica's Todd Perez shows us their TXP mechanical preparation system and the TIC 3X triple ion beam cutting system.

The TXP is a multifunctional instrument capable of cutting, grinding and polishing, elimination the need for several instruments. It can be operated in either manual or automated modes and is fully controllable.

The TIC 3X is a cross-sectional system for preparation of wide polished surfaces. Being a triple ion beam system, it is faster than single and double beam systems. It includes a microscope with up to 225X magnification and a decoupled pump to eliminate vibration. It can be used with either single, multi or cryo (featuring heating or cooling) stages.

Applications for the TXP and TIC 3X include semiconductors, food and metallography.

Run time - 4:35

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