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More: https://www.pi-usa.us/en/tech-blog/ho Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include positioning the cut accurately, to minimize the loss of material, and to minimize distortions of the components. Air bearing linear and rotary positioning stages provide the speed, accuracy and clean room compatibility required. Application Info: https://www.pi-usa.us/en/apps-tech/ap
Run Time - 1:26mins
Video Credit: PI (Physik Instrumente) LP
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