High Performance Laser Dicing / Processing with Air Bearing Motion Systems and EtherCat Controller

More: https://www.pi-usa.us/en/tech-blog/ho Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include positioning the cut accurately, to minimize the loss of material, and to minimize distortions of the components. Air bearing linear and rotary positioning stages provide the speed, accuracy and clean room compatibility required. Application Info: https://www.pi-usa.us/en/apps-tech/ap

Run Time - 1:26mins

Air Bearing Multi-Axis Stage Motion Systems for High Precision Laser Dicing / Processing

Video Credit: PI (Physik Instrumente) LP

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