The EVG®150 has been designed as a completely modular platform and therefore enables high-throughput performance and automated spray/spin/develop processes. The EVG®150 ensures highly even coats and enhanced repeatability. Wafers with high topography can be coated evenly by EVG’s OmniSpray technology, where conventional spin coating faces restrictions.
Features
- Availability of up to six process modules
- Wafer sizes range up to 300 mm
- Customizable number — up to 20 bake or chill or vapor prime stacks
- Up to four FOUP load ports or cassette loading available
- EV Group’s proprietary OmniSpray® ultrasonic atomization technology offers matchless process findings when conformal coating of extreme topographies is concerned
- Modules available include Develop, NanoCoat™, Spin Coat, Spray Coat, Prime/Vapor/Chill/Bake/
- Optional NanoSpray™ module reaches conformal coating of 300 micron deep patterns with aspect ratios ranging up to 1:10 and vertical sidewalls
- Bake modules range up to 250 °C
- Wide range of supported materials
- Advanced and field-proven robot handling with dual end-effector capability guarantees constant high throughput
- Megasonic technology for cleaning, sono-chemical processing and developing enhances process efficiency and reduces the process time from hours to minutes
- Thick or ultra-thin, delicate, bowed, or small-diameter wafers can be handled
- Process technology excellence and development service provided
- Adaptable combinations of multi-functional modules available for spin and spray coating, developing, bake and chill offer great chances in several fields of application
- Multi-user concept (limitless number of user accounts and recipes, different user interface languages, and assignable access rights)
- Optional FSS (FOUP Storage System) and EFEM (Equipment Frontend Module)
- Intelligent process control and data analysis feature (Framework SW Platform)
- Combined analysis features for process and machine control
- Parallel or queueing task processing feature
- Equipment and process performance tracking feature available
- Smart handling features are available
- Come with smart maintenance management and tracking
- Occurrence and alarm analysis
Technical Data
| . |
. |
| Number of modules |
Process modules: up to 6
Bake / chill modules: up to 20 |
Industrial automation
features |
Ergo load cassette stations / SMIF loadports / SECS/GEM / FOUP load ports |
Smart process control &
data analysis features
(framework SW platform) |
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurrences and alarms analysis / smart maintenance management & tracking |
Wafer diameter
(substrate size) |
Up to 300 mm |
| Available modules |
Spin coat / OmniSpray® / develop
Bake / chill |
Wafer handling
options |
Single/double EE / edge handling / wafer flipping
Bowed / warped / thin wafer handling |
| Dispense options |
Various resist despense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system |
Resist dispense
pump features
flowmonitoring |
Programmable dispense rate / programmable volume / programmable suck-back
Ultrasonic |
Additional module
options |
Pre-alignment: optical / mechanical
ID-reader: barcode, alpha-numeric, data matrix |
| System control |
Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user
GUI & support: CN, DE, FR, IT, JP, KR |
Source: EV Group