EVG®520 HE Semi-Automated Hot Embossing System

The EVG520 HE Semi-automated Hot Embossing System has been developed specifically for high-precision imprinting of thermoplastic substrates. EVG’s production-proven system supports substrates measuring up to 200 mm in diameter, and is consistent with standard semiconductor manufacturing technologies.

The hot embossing system has been designed with a versatile embossing chamber as well as high-contact and high-vacuum force capabilities, and regulates the entire range of polymers appropriate for hot embossing. Along with multiple de-embossing and high-aspect-ratio embossing options, several processes for high-quality pattern transfer and nanometer resolution are provided.


  • Automated embossing process is available
  • Suitable for hot embossing and nanoimprinting applications of spin-on polymers and polymer substrates
  • Pneumatic de-embossing options available
  • Software-controlled process execution can be performed
  • EVG’s proprietary separate alignment process available for optically aligned embossing and imprinting

Technical Data

Heater size 150 mm 200 mm
Maximum substrate dimension 150 mm 200 mm
Minimum substrate dimension single chips 100 mm
Max. contact force
10, 20, 60, 100 kN
Max. temperature
Standard: 350 °C
Optional: 550 °C
Bond chuck system / alignment system
150 mm heater: EVG®610, EVG®620, EVG®6200
200 mm heater: EVG®6200, MBA300, SmartView® NT
Standard: 0.1 mbar
Optional: 0.00001 mbar

​Source: EV Group 

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