The EVG620 automated bond alignment system is well-known for its high level of reliability and automation and has been developed for wafer-to-wafer alignment ranging up to 150 mm wafer sizes.
EV Group’s bond alignment systems provide the highest flexibility, accuracy, user-friendliness and modular upgrade capability, while being competent in several high-throughput production settings. The accuracy of EVG’s bond alignment system adapts to the most challenging alignment processes in MEMS production and in developing fields such as 3D integration applications.
Features
- Better suited for EVG®501, EVG®510 and EVG®520 IS bonding systems
- Motorized or manual alignment stage available
- Rapid tool change between various wafer sizes and various bonding applications
- Assists bond alignment of double or triple wafer stacks ranging up to 150 mm wafer sizes
- Windows®-based user interface
- Completely motorized high-resolution bottom-side microscopes
- Options
- IR alignment available for inner substrate key alignment
- Automatic alignment
- Comes with system rack
- Upgrade possibility to mask aligner
- NanoAlign® package for improved process abilities
Technical Data
| . |
. |
General
system configuration |
Desktop
System rack: optional
Vibration isolation: passive |
| Alignment methods |
Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option |
| Alignment stage |
Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated |
Substrate / Wafer
parameters |
Size: 2", 3", 100 mm, 150 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm |
| Automatic alignment |
Optional |
| Handling system |
Standard: 3 cassette stations
Optional: up to 5 stations |
Source: EV Group