EVG®620 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment

The EVG620 automated bond alignment system is well-known for its high level of reliability and automation and has been developed for wafer-to-wafer alignment ranging up to 150 mm wafer sizes.

EV Group’s bond alignment systems provide the highest flexibility, accuracy, user-friendliness and modular upgrade capability, while being competent in several high-throughput production settings. The accuracy of EVG’s bond alignment system adapts to the most challenging alignment processes in MEMS production and in developing fields such as 3D integration applications.


  • Better suited for EVG®501, EVG®510 and EVG®520 IS bonding systems
  • Motorized or manual alignment stage available
  • Rapid tool change between various wafer sizes and various bonding applications
  • Assists bond alignment of double or triple wafer stacks ranging up to 150 mm wafer sizes
  • Windows®-based user interface
  • Completely motorized high-resolution bottom-side microscopes
  • Options
    • IR alignment available for inner substrate key alignment
    • Automatic alignment
    • Comes with system rack
    • Upgrade possibility to mask aligner
    • NanoAlign® package for improved process abilities

Technical Data

. .
system configuration
System rack: optional
Vibration isolation: passive
Alignment methods Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option
Alignment stage Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated
Substrate / Wafer
Size: 2", 3", 100 mm, 150 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm
Automatic alignment Optional
Handling system Standard: 3 cassette stations
Optional: up to 5 stations

​Source: EV Group 

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