EVG®620 NT: State-of-the-Art Mask Alignment Technology

The EVG®620 NT is well-known for its reliability and flexibility, and offers advanced mask alignment technology on a compact footprint area with the latest alignment features and improved total cost of ownership.

It is a perfect tool for optical double-side lithography that comes in automated or semi-automated configuration with optional full-housing Gen 2 solution to satisfy high-volume production needs and fab standards.

User-friendly software, reduced time for tooling and mask changes, together with effective global service and support makes it the perfect solution for any manufacturing setting.

The EVG®620 NT or the completely housed EVG®620 NT Gen2 mask alignment systems are fitted with built-in vibration isolation and realize outstanding exposure results for an extensive range of applications, like patterning of deep cavities, comparable topographies and exposure of thick and thin resists, as well as the processing of fragile and thin materials like compound semiconductors.

Moreover, EVG’s proprietary SmartNIL technology works on both fully automated and semi-automated system configurations.

Features

  • System design supports the versatility of lithography processes
  • Wafer or substrate size from pieces up to 150 mm/6″
  • Auto origin function for accurate centering of the alignment key
  • Thin, delicate, or warped wafer handling of several wafer sizes with rapid change-over time
  • Automated contact-free wedge compensation sequence available with proximity spacers
  • Dynamic alignment function with real-time offset correction
  • Field upgradeable from semi-automated to completely automated version
  • Supports the advanced UV-LED technology
  • Reduced system footprint and facility needs available
  • Comes with rework sorting wafer management and a flexible cassette system
  • Manual substrate loading capability on the automated system can be done
  • Multi-user concept (limitless number of user accounts and recipes, different user interface languages, and assignable access rights)
  • Remote tech support and SECS/GEM compatibility available
  • Latest SW features and compatibility between R and D and full-scale production
  • Agile processing and conversion re-tooling can be performed
  • Extra capabilities:
    • Nanoimprint lithography (NIL)
    • Bond alignment
    • IR alignment

Technical Data

. .
Exposure source Mercury light source / UV LED light source
Advanced alignment
features
Manual alignment / in-situ alignment verification
Automatic alignment
Dynamic alignment / automatic edge alignment
Alignment offset correction algorithms
Throughput Fully-automated: throughput first print: 180 wafers per hour
Fully-automated: throughput aligned: 140 wafers per hour
Wafer diameter
(substrate size)
Up to 150 mm
Alignment modes Top side alignment: ≤ ±0,5 µm
Bottom side alignment: ≤ ±1,0 µm
IR alignment: ≤ ±2,0 µm / substrate material depending
Bond alignment: ≤ ±2,0 µm
NIL alignment: ≤ ±3,0 µm
Exposure setup Vacuum contact / hard contact / soft contact / proximity mode / flex mode
Wedge compensation Fully automatic - SW controlled
Exposure options Interval exposure / flood exposure / sector exposure
System control Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting
Industrial automation
features
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling
Nanoimprint lithography technology SmartNIL®


​Source: EV Group 

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