EVG®20 IR Inspection System: Fast Void Inspection of Bonded Wafer Stacks

The EVG20 IR Inspection System provides a quick inspection technique, specifically for fusion-bonded wafers. A live image of the complete wafer through IR transmission assists void detection down to a radius measuring 0.5 mm. The infrared inspection system is an ideal match for fusion bonding processes either as the independent EVG20 tool or as a station in EVG’s combined bonding systems.

Features

  • One-shot inspection of the complete wafer
  • Live imaging
  • Void size detection down to radius measuring 0.5 mm
  • Maszara test compatible
  • Optional bond pin available for live visualization of direct bonding

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