Posted in | Flaw Detection & Inspection

EVG®20 IR Inspection System: Fast Void Inspection of Bonded Wafer Stacks

Need more information?

Let us help you with your inquiries, brochures and pricing requirements

EV Group logo.

The EVG20 IR Inspection System provides a quick inspection technique, specifically for fusion-bonded wafers. A live image of the complete wafer through IR transmission assists void detection down to a radius measuring 0.5 mm. The infrared inspection system is an ideal match for fusion bonding processes either as the independent EVG20 tool or as a station in EVG’s combined bonding systems.

Features

  • One-shot inspection of the complete wafer
  • Live imaging
  • Void size detection down to radius measuring 0.5 mm
  • Maszara test compatible
  • Optional bond pin available for live visualization of direct bonding

Other Equipment by this Supplier

EVG’s Heterogeneous Integration Competence Center

EVG’s Heterogeneous Integration Competence Center
EVG® NILPhotonics® Competence Center: A Flexible Cooperation Model

EVG® NILPhotonics® Competence Center: A Flexible Cooperation Model
EVG®101: Single-Wafer Resist Processing System

EVG®101: Single-Wafer Resist Processing System
EVG®105 Bake Module: For Soft- or Post-Exposure Bake Processes

EVG®105 Bake Module: For Soft- or Post-Exposure Bake Processes
EVG®120: Compact, Cost-Effective Resist Processing System

EVG®120: Compact, Cost-Effective Resist Processing System
EVG®150: Fully-Automated Resist Processing System

EVG®150: Fully-Automated Resist Processing System
EVG®320 D2W: Automated Die Preparation and Activation System

EVG®320 D2W: Automated Die Preparation and Activation System
EVG®40 NT: High-Accuracy Metrology for Bonding and Lithography

EVG®40 NT: High-Accuracy Metrology for Bonding and Lithography
EVG®50: Automated Metrology System for Bonded Stacks and Single Wafers

EVG®50: Automated Metrology System for Bonded Stacks and Single Wafers
EVG®510 HE Semi-Automated Hot Embossing System

EVG®510 HE Semi-Automated Hot Embossing System
EVG®520 HE Semi-Automated Hot Embossing System

EVG®520 HE Semi-Automated Hot Embossing System
EVG®610 BA Bond Alignment System for Wafer-to-Wafer Alignment up to 200 mm

EVG®610 BA Bond Alignment System for Wafer-to-Wafer Alignment up to 200 mm
EVG®610 UV: Nanoimprint Lithography Systems

EVG®610 UV: Nanoimprint Lithography Systems
EVG®620 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment

EVG®620 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment
EVG®620 NT: State-of-the-Art Mask Alignment Technology

EVG®620 NT: State-of-the-Art Mask Alignment Technology
EVG®6200 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment

EVG®6200 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment
EVG®6200 NT Mask Aligner: State-of-the-Art Mask Alignment Technology

EVG®6200 NT Mask Aligner: State-of-the-Art Mask Alignment Technology
EVG®720: Automated SmartNIL® UV Nanoimprint Lithography System

EVG®720: Automated SmartNIL® UV Nanoimprint Lithography System
EVG®7200: Automated SmartNIL® UV Nanoimprint Lithography System

EVG®7200: Automated SmartNIL® UV Nanoimprint Lithography System
EVG®7300: Automated UV Nanoimprint Solution up to 300 mm

EVG®7300: Automated UV Nanoimprint Solution up to 300 mm
EVG®770: Step-and-Repeat Nanoimprint Lithography System

EVG®770: Step-and-Repeat Nanoimprint Lithography System
EVG7200: Large-Area UV Nanoimprint System

EVG7200: Large-Area UV Nanoimprint System
GEMINI® FB: Automated Collective Die-to-Wafer Bonding System

GEMINI® FB: Automated Collective Die-to-Wafer Bonding System
Helping Semiconductor Manufacturing Technologies with the Semi-Automated Hot Embossing System

Helping Semiconductor Manufacturing Technologies with the Semi-Automated Hot Embossing System
HERCULES®: Integrated Lithography Track System for Cassette-to-Cassette Processing

HERCULES®: Integrated Lithography Track System for Cassette-to-Cassette Processing
Improving Quality with the Automated Resist Processing System for Micro- and Nano-Electronics

Improving Quality with the Automated Resist Processing System for Micro- and Nano-Electronics
IQ Aligner® NT: Technically Advanced Automated Mask Alignment System

IQ Aligner® NT: Technically Advanced Automated Mask Alignment System
IQ Aligner®: Contactless Proximity Lithography Platform

IQ Aligner®: Contactless Proximity Lithography Platform
LITHOSCALE®: Highly Versatile Maskless Exposure Lithography Platform

LITHOSCALE®: Highly Versatile Maskless Exposure Lithography Platform
SmartView® NT: Automated Bond Alignment System for Universal Alignment

SmartView® NT: Automated Bond Alignment System for Universal Alignment
Supporting a Variety of Standard Lithography Processes with the EVG®610

Supporting a Variety of Standard Lithography Processes with the EVG®610

Terms

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.

Provide Feedback