The EVG20 IR Inspection System provides a quick inspection technique, specifically for fusion-bonded wafers. A live image of the complete wafer through IR transmission assists void detection down to a radius measuring 0.5 mm. The infrared inspection system is an ideal match for fusion bonding processes either as the independent EVG20 tool or as a station in EVG’s combined bonding systems.
- One-shot inspection of the complete wafer
- Live imaging
- Void size detection down to radius measuring 0.5 mm
- Maszara test compatible
- Optional bond pin available for live visualization of direct bonding