HERCULES®: Integrated Lithography Track System for Cassette-to-Cassette Processing

The HERCULES integrated lithography track system is based on a modular platform and integrates EVG’s proven optical mask alignment technology with built-in wafer cleaning, baking, resist coating and resist development modules.

The HERCULES system allows cassette-to-cassette processing of different sizes of wafers. It safely handles rectangular, highly bowed, thick, small-diameter wafers and even device trays.

Precision bottom-side and top-side alignment as well as a sub-micron coating to ultra-thick (up to 300 µm) resists can be used for passivation and interlayer applications. The excellent alignment stage design allows highly precise alignment and exposure outcomes at high throughput.

Features

  • Multipurpose platform supports completely automated processing of different shapes and sizes of substrates, highly warped mold wafers and even device trays
  • Production platform integrates all the benefits of EVG’s precision alignment and resist processing systems in a small footprint
  • Coating of up to 52,000 cP helps produce ultra-thick resist features of up to 300 µm in height
  • NanoSpray® for coating and protection through structures
  • OmniSpray® coating for improved coating of high-topography surfaces
  • CoverSpin™ rotating cover ensures low-resist consumption and improved uniformity of resist coating
  • Mask handling and storage are fully automated
  • Thin, delicate, or warped wafer handling of various wafer sizes with a bridge-tool system
  • Optical edge exposure and/or solvent cleaning removes edge beads
  • Multi-user concept (infinite number of user recipes and accounts, different user interface languages, and assignable access rights)
  • Flexible cassette system and rework sorting wafer management

Technical Data

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Alignment modes Top side alignment: ≤ ±0,5 µm
Bottom side alignment: ≤ ±1,0 µm
IR alignment: ≤ ±2,0 µm / substrate material depending
Advanced alignment
features
Manual alignment
Automatic alignment
Dynamic alignment
Alignment offset correction
Automatic cross correction / manual cross correction
Large gap alignment
Industrial automation
features
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling
Exposure source Mercury light source / UV LED light source
Exposure setup Vacuum contact / hard contact / soft contact / proximity mode / flex mode
Wedge compensation Fully automatic - SW controlled
Contactless
Exposure options Interval exposure / flood exposure / sector exposure
System control Operations system: Windows
File sharing and back-up solution / unlimited no. recipes and parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting


​Source: EV Group 

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