The EVG610 bond alignment system has been developed for wafer-to-wafer alignment ranging up to 200 mm wafer sizes. The bond alignment systems from EV Group provide a manual high-precision alignment stage with bottom-side microscope.
The EVG bond alignment system’s accuracy encompasses the most challenging alignment processes in MEMS production and in new fields such as 3D integration applications
Features
- Manual high-precision alignment stage available
- Highly relevant for EVG®501 and EVG®510 bonding systems
- Desktop system design comes with a highly compact footprint
- Wafer and substrate sizes range up to 150/200 mm
- Windows® based user interface
- Ideal total cost of ownership (TCO) for R&D and pilot line production
- Manual-operated bottom-side microscope
- Supports IR alignment process
- Ideal multi-user concept (different user interface languages, various access rights and limitless number of user accounts)
Technical Data
| . |
. |
General system
configuration |
Desktop
System rack: optional
Vibration isolation: passive |
| Alignment methods |
Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option |
| Alignment stage |
Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated |
Substrate / Wafer
parameters |
Size: 2", 3", 100 mm, 150 mm, 200 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm |
| Automatic alignment |
Optional |
| Handling system |
Standard: 2 cassette stations
Optional: up to 5 stations |
Source: EV Group