EVG®610 BA Bond Alignment System for Wafer-to-Wafer Alignment up to 200 mm

The EVG610 bond alignment system has been developed for wafer-to-wafer alignment ranging up to 200 mm wafer sizes. The bond alignment systems from EV Group provide a manual high-precision alignment stage with bottom-side microscope.

The EVG bond alignment system’s accuracy encompasses the most challenging alignment processes in MEMS production and in new fields such as 3D integration applications


  • Manual high-precision alignment stage available
  • Highly relevant for EVG®501 and EVG®510 bonding systems
  • Desktop system design comes with a highly compact footprint
  • Wafer and substrate sizes range up to 150/200 mm
  • Windows® based user interface
  • Ideal total cost of ownership (TCO) for R&D and pilot line production
  • Manual-operated bottom-side microscope
  • Supports IR alignment process
  • Ideal multi-user concept (different user interface languages, various access rights and limitless number of user accounts)

Technical Data

. .
General system
System rack: optional
Vibration isolation: passive
Alignment methods Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option
Alignment stage Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated
Substrate / Wafer
Size: 2", 3", 100 mm, 150 mm, 200 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm
Automatic alignment Optional
Handling system Standard: 2 cassette stations
Optional: up to 5 stations

​Source: EV Group 

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