EVG®6200 BA: Automated Bond Alignment System for Wafer-to-Wafer Alignment

The EVG6200 BA bond alignment systems provide the highest flexibility, accuracy, modular upgrade capability and user-friendliness while being competent in several high-throughput production settings. The accuracy of EVG bond aligners adapts to the most challenging alignment processes in MEMS production and in developing fields such as 3D integration applications.


  • Completely motorized high-resolution bottom-side microscopes
  • Appropriate for all EVG 200 mm bond systems
  • Supports bond alignment of double or triple wafer stacks ranging up to 200 mm wafer sizes
  • Manual or motorized alignment stage available with automatic alignment option
  • Comes with Windows®-based user interface
  • Options
    • Automatic alignment
    • IR alignment provided for inner substrate key alignment
    • NanoAlign® package for improved process abilities
    • Upgrade possibility for mask aligner
    • Comes with system rack

Technical Data

. .
General system
System rack: optional
Vibration isolation: passive
Alignment methods Backside alignment: ±2 µm 3 σ
Transparent alignment: ±1 µm 3 σ
IR alignment: option
Alignment stage Precision micrometers: manual
Optional: motorized micrometers
Wedge compensation: automated
Substrate / Wafer
Size: 2", 3", 100 mm, 150 mm, 200 mm
Thickness: 0,1 - 10 mm
Max. stack height: 10 mm
Automatic alignment Optional
Handling system Standard: 3 cassette stations
Optional: up to 5 stations

​Source: EV Group 

Other Equipment by this Supplier

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.