The Heterogeneous Integration Competence Center from EV Group has been developed particularly to support customers in leveraging EVG’s process solutions and expertise to allow new and improved products and applications driven by progress in system integration and packaging.
These consist of solutions and applications for photonics and advanced sensors, medical and wearable devices, autonomous vehicles, the Internet of Things (IoT), and high-performance computing and data centers.
EVG’s new HI Competence Center offers an open-access innovation incubator for their customers and collaborators throughout the microelectronics supply chain to unite while pooling the company’s solutions and process technology resources to reduce development cycles and time to market for novel devices and applications powered by heterogeneous integration.
Features
- EVG Heterogeneous Integration Competence Center™ Open Access Innovation Incubator
- Advanced resist processing
- Fusion and hybrid bonding available for D2W and W2W bonds
- Maskless exposure technology
- Aligned metal bonding
- Temporary bonding and debonding open platform is available
- Optical lithography
EVG’s HI Competence Center has been developed to help develop new products and applications powered by progress in system integration and packaging.
Chiplet integration by collective die-to-wafer hybrid bonding. Image Credit: EV Group
The Heterogeneous Integration Competence Center™ integrates EV Group’s best-in-class wafer bonding, lithography products and expertise and thin-wafer handling, as well as pilot-line production facilities and services at its sophisticated cleanroom facilities.
Image Credit: EV Group