The EVG50 (completely automated independent tool) and the Inline Metrology Module (combined in EVG’s high-volume-manufacturing systems) provide highly precise measurements at high speed, making use of various measurement techniques for a huge number of applications.
The application range of the tool covers multi-layer thickness measurements for determining the total thickness variation (TTV) of an intermediate layer, inspecting bond interfaces and measuring resist thickness while satisfying the most demanding needs of the yield-driven semiconductor industry.
- Multi-layer thickness mapping available
- Multi-layer metrology available with best-in-class throughput and resolution
- Particle free
- Low contact edge handling can be performed
- Bond interface inspection
- Several output formats available
- 100% production inspection
- Full-area accessible front- and backside
- Self-calibrating for improved system reproducibility and more productive time