The IQ Aligner from EV Group is a contactless proximity lithography platform that has been specifically developed with a high grade of automation that satisfies the need for reducing mask contamination in production lines and increasing product yield and mask lifetime.
Besides several alignment features, the system has been extensively installed and field-proven with specific configurations developed for automated handling and processing of thinned or warped wafers.
Users can mix and match operation between standard top- or bottom-side alignments with combined IR alignment abilities and further broaden the field of applications, particularly on alignment with bonded or engineered substrates. Moreover, the system supports wafer alignment run-out control with fast-response and temperature-controlled toolsets.
Features
- Wafer or substrate size from pieces ranging up to 200 mm/8″
- Contactless proximity mode as a result of external wafer wedge measurement
- Comes with run-out control alignment feature
- Improved vibration isolation
- Remote tech support and GEM/SECS compatibility
- Higher process flexibility with several alignment features
- Manual substrate loading capability available
- Warped, thin, or delicate wafer handling of various wafer sizes
- Taiko wafer processing experience
- Additional capabilities:
- IR alignment—transmissive and/or reflective
Technical Data
| .t |
. |
| Wedge compensation |
Fully automatic - SW controlled
Contactless |
Advanced alignment
features |
Automatic alignment
Large gap alignment
Run-out control alignment
Dynamic alignment |
| Industrial automation features |
Cassette / SMIF / FOUP / SECS/GEM / thin, bowed, warped, edge wafer handling |
Wafer diameter
(substrate size) |
Up to 200 mm |
| Alignment modes |
Top side alignment: ≤ ±0,5 µm
Bottom side alignment: ≤ ±1,0 µm
IR alignment: ≤ ±2,0 µm / substrate material depending |
| Exposure setup |
Vacuum contact / hard contact / soft contact / proximity mode / flex mode |
| Exposure options |
Interval exposure / flood exposure |
| System control |
Operations system: Windows
File sharing and back-up solution / unlimited no. recipes and parameters
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR
Real-time remote access, diagnostics & troubleshooting |
| Throughput |
Fully-automated: throughput first print: 85 wafers per hour
Fully-automated: throughput aligned: 80 wafers per hour |
Source: EV Group