EVG®101: Single-Wafer Resist Processing System

The EVG101 resist processing system from EV Group carries out R&D-type processes on a single chamber design, which is completely compatible with the company’s automated systems. The EVG101 can be configured for spray or spin coating and developing while also supporting wafers up to 300 mm.

Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This guarantees low material consumption of precious high-viscosity polymers or photoresists while enhancing uniformity and resist spreading options.

Features

  • Automated spray or spin coating or developing with manual wafer load/unload
  • Supports wafer size of up to 300 mm
  • Fast and easy process transfer from research to production with proven standardized software and modular design
  • Multi-user concept (limitless user accounts and recipes, different user interface languages, assignable access rights)
  • Syringe dispense system for using small resist volumes, such as high-viscosity resists
  • Compact footprint while maintaining a high level of personal and process safety
  • Options:
    • Spin-On-Glass (SOG) coating
    • Wax and epoxy coating for successive bonding processes
    • Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology

Technical Data

. .
Available modules Spin coat / OmniSpray® / develop
Dispense options Various resist dispense pumps to cover a wide range of viscosities up to 52000 cP
Liquid priming / pre-wet / bowl wash
Edge bead removal (EBR) / back-side rinse (BSR)
Constant pressure dispense systems / syringe dispense system
Smart process control &
data analysis features
(framework SW platform)
Integrated analysis features for process and machine control
Parallel task / queueing task processing feature
Equipment and process performance tracking feature
Smart handling features
Occurrences and alarms analysis / smart maintenance management & tracking
Wafer diameter
(substrate size)
Up to 300 mm
Spin coat module -
spinner parameter
Spin speed: up to 10 k rpm
Acceleration speed: up to 10 k rpm
Spray coat module -
spray generation
Ultrasonic atomization nozzle / high-viscosity nozzle
Develop module -
dispense options
Puddle development / spray development
Additional module
options
Pre-alignment: mechanical
System control Operations system: Windows
File sharing & back-up solution / unlimited no. recipes & parameters / offline recipe editor
Flexible process flow definition / easy drag and drop recipe programming
Parallel processing of multiple jobs / real-time remote access, diagnostics & troubleshooting
Multi-language user GUI & support: CN, DE, FR, IT, JP, KR


​Source: EV Group 

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