Automated Production of Photonic Devices - AssemblyLine Systems

The AssemblyLine systems from ficonTEC are high-precision, alignment and assembly machine solutions. They are designed for automated manufacture (align-and-attach) of photonic components. They uniquely combine fast-active alignment and flexible attachment configurations, with a proven software control interface, enclosed in an industry-standard design.

Optional modules can be added to the base configuration to provide more features, and the high-end versions provide optical test modules, wafer processing capability, and automatic tool changing.

New, advanced in-line assembly systems from ficonTEC include a redesigned platform (800, 1200, and 1600). They are provided in specific in-line configurations for insertion into current production lines, and as a versatile and separate stand-alone production cell.

Additionally, they can be supplied as task-enhanced production segments that consist of different uniquely configured systems. It is feasible to visualize even complete production lines.

ficonTEC - Next-generation In-line Photonics Assembly & Test Systems

Software Control

ficonTEC’s Process Control Master (PCM) is a process-driven, easy-to-use application software and control interface that is provided with complete multi-machine configurations and all turnkey systems.

PCM combines a smart UI with all machine vision, high-resolution positioning, and system management procedures required for dependable and repeatable running of active/passive alignment and attachment/bonding process hardware.

It is also already totally supported for automated electro-optical test and characterization operations. It can also manage and track single lines, and even sync parallel lines remotely.

Key Features

  • 100% automated photonic device assembly
  • High-accuracy AutoAlign multi-axis motion
  • Configurable closed-loop fast-active alignment
  • Epoxy dispensing, curing, and shrinkage control
  • Numerous chip and wafer handling options

Standard Tasks and Applications

  • Thermal or UV curing
  • Pick-and-place
  • Chip-to-package assembly
  • Active VBG spectral tuning
  • Fiber/FAC/SAC align-and-attach
  • Precision adhesive dispensing
  • Active mirror align-and-attach
  • PICs, silicon photonics
  • HPLD module assembly
  • Hybrid integrated photonics

Modular, Flexible, and (Re-)Configurable

  • Operate, track, and sync parallel lines remotely
  • FAB and HVM-ready: scalable and parallelizable
  • Modern feed In/Out options
  • Daisy-chain multiple systems for production divisions
  • Add and/or swap units for repurposing and reconfiguration
  • Single systems slot into current production lines

Other Equipment