EM TIC 3X is a reconfigurable ion beam milling system that uses three broad beams to produce high-quality milling surfaces, revealing actual interior sample structures for subsequent electron microscopy investigation.
Stereo-microscope alignment, sample holder compatibility, and interchangeable stages provide effective, uniform preparation for a variety of studies.
- By producing excellent milling surfaces with three broad beams and "pristine surface quality," the true internal structure and composition can be revealed for EM examination.
- Three wide beams create excellent milling surfaces "without the need for stage rotation," simplifying preparation.
- Buried targets can be hit more consistently by using a stereo microscope to align the sample with the mask and ion guns, while monitoring and recording the procedure.
- Enable high-resolution SEM analysis (e.g., of battery components) by improving foil and multi-layer cross-section quality through effective preparation that minimizes redeposition and delamination.
- Using the same holder for EM TXP and EM TIC 3X will minimize handling steps and maintain orientation consistency throughout the procedure.
- Use a cooling-stage setup to facilitate low-temperature preparation for heat-sensitive materials.
Image Credit: Leica Microsystems - Nanotechnology & EM Sample Preparation - EMEA