EM TXP is a mechanical cross-sectioning device for precise downsizing and visual inspection. By removing unwanted material during pre-cutting and enabling fine polishing, it helps uncover buried structures, reduce broad ion beam milling time, and create mirror-like surfaces for light microscopy inspection - while you observe the process under a stereomicroscope.
Key Features
- Shorten downstream broad ion beam milling time by removing unwanted material during precise pre-cutting to uncover buried structures before ion beam processing.
- Improve light microscopy inspection accuracy by creating mirror-like cross-section surfaces through fine polishing for visual inspection.
- Reach your area of interest faster and more precisely with multi-tool preparation and accurate positioning of tool rotation and tilt angle for each process step.
- Reduce the risk of missing barely visible targets by revealing sample structure safely under continuous stereo microscope observation during preparation.
- Bring multiple preparation steps into one benchtop workflow by combining techniques such as sawing, grinding, polishing, milling, and core drilling in a single system.
- Reduce handling steps and keep orientation consistent across the workflow by using the same holder for EM TXP and EM TIC 3X, helping maintain mounting and orientation through surface preparation.
- Reduce hands-on intervention during processing with integrated automatic process control.