The Hitachi IM4000II and ArBlade 5000 ion milling systems provide high-precision sample preparation for scanning electron microscopy. Suitable for metals, semiconductors, polymers, ceramics, and layered materials, they deliver high-quality cross-sections and polished surfaces with minimal artifacts.
Developed for academic research, industrial quality control, and materials science laboratories, both systems offer fast, repeatable results - making them essential tools for advanced electron microscopy applications.
- High milling rate: Fast, efficient sample preparation for hard materials
- Cross-section & flat milling: Flexible options to suit different applications
- Cryogenic cooling (optional): Protects temperature-sensitive samples from damage
- User-friendly interface: Intuitive touch-screen controls for simple operation
- Optimized for SEM & AFM: Fully compatible with Hitachi and third-party microscopes
Image Credit: Hitachi High-Tech Europe
IM4000II
The IM4000II is an all-in-one device that can be used for cross-section and/or flat milling, making it a versatile alternative for labs that require basic sample prep equipment.
Image Credit: Hitachi High-Tech Europe
ArBlade 5000
The ArBlade 5000, the more advanced system, offers a higher milling rate and wide-area cross-section milling, making it ideal for demanding applications and laboratories that require high throughput.
Image Credit: Hitachi High-Tech Europe
Features and Benefits
Fast and Precise Milling for a Wide Range of Materials
Reduced turnaround times without compromising sample integrity.
- An amazing 1 mm/hour or more is offered by the ArBlade 5000 (for Si sample with protrusion of 100 μm), while the IM4000II achieves a milling rate of 500 μm/hour
- Ideal for hard materials that require prolonged milling, such as metals and semiconductors
Image Credit: Hitachi High-Tech Europe
Cross-Section and Flat Milling for Flexible Sample Preparation
Get the flexibility to prepare samples exactly the way you need.
- Cross-section milling creates smooth, undistorted surfaces without mechanical stress - perfect for studying the internal structures of composite materials, multilayer films, and electronic components.
- Flat milling removes surface artifacts to deliver clean, high-contrast imaging, which is especially important for applications such as EBSD.
Image Credit: Hitachi High-Tech Europe
Wide-Area Cross-Section Milling (Arblade 5000 Only)
Easily prepare large samples with confidence.
- With milling capability up to 10 mm in width, this system is well-suited for electronic devices and industrial materials.
- Delivers a uniform cross-section across large samples, ensuring greater accuracy in both imaging and analysis.
Image Credit: Hitachi High-Tech Europe
Cryogenic Cooling for Temperature Sensitive Sample
Preserve sample integrity for high-resolution imaging.
- The optional Cooling Temperature Control feature for the IM4000II and ArBlade 5000 protects delicate materials, such as polymers, from heat damage.
- Maintains a precise temperature range of 0 °C to -100 °C using liquid nitrogen
Image Credit: Hitachi High-Tech Europe
Seamless Integration with Scanning Electron Microscopes (SEMs)
Ensure contamination-free imaging for air-sensitive samples.
- The Air Protection Holder Unit, available for both the IM4000II and ArBlade 5000, enables sample transfer to SEM or AFM without exposure to air.
- It is compatible with Hitachi systems as well as third-party instruments, supporting smooth and reliable workflows.
Image Credit: Hitachi High-Tech Europe
Applications Gallery
Metals and Alloys
Prepare cross-sections of hard materials for microstructural analysis. Image Credit: Hitachi High-Tech Europe
Batteries
Cross-section of Li Ion Battery Anode. Image Credit: Hitachi High-Tech Europe
Electronics and Semiconductors
Expose layers and interfaces in integrated circuit. Image Credit: Hitachi High-Tech Europe
Polymers and Soft Materials
Prevent deformation in temperature-sensitive samples. Image Credit: Hitachi High-Tech Europe
Multilayer Films and Coatings
Study layer composition and adhesion quality. Image Credit: Hitachi High-Tech Europe
Hard Materials
Cross-section milling example. Image Credit: Hitachi High-Tech Europe
Specifications
Source: Hitachi High-Tech Europe
| |
IM4000II |
ArBlade 5000 |
| Gas Used |
Ar (argon) gas |
Ar (argon) gas |
| Accelerating Voltage |
0 to 6 kV |
0 to 8 kV |
| Maximum Milling Rate (estimated for Si samples and 100 μm protrusion) |
500 μm/h or more |
≥ 1 mm/h |
| Maximum Milling Width |
Not available |
10 mm |
| Maximum Specimen Size |
20(W) x 12(D) x 8(H) mm |
20(W) x 12(D) x 8(H) mm |
| Sample Moving Range |
X: ±7 mm, Y: 0 to +3 mm |
X: ±7 mm, Y: 0 to +3 mm |
| Ion Beam Intermittent Irradiation |
ON/OFF setting (1 sec to 59 min 59 sec) |
Standard function |
| Swing angle |
±15 °, ±30 °, ±40 ° |
±15 °, ±30 °, ±40 ° |
| Wide-Area Cross-Section milling |
Not available |
Up to 10 mm width |
| Flat Milling Area |
φ 32 mm |
φ 32 mm |
| Maximum Flat-Milled Sample Size |
φ 50 x 25(H) mm |
φ 50 x 25(H) mm |
| Rotation Speed |
1 rpm, 25 rpm |
1 rpm, 25 rpm |
| Tilt Range |
0 to 90 ° |
0 to 90 ° |
| Cooling Temperature Control (optional) |
0 to -100 °C via LN2 |
0 to -100 °C via LN2 |
| Higher Beam Tolerance Mask (optional) |
2x beam tolerance (Cobalt-free) |
2x beam tolerance (Cobalt-free) |
| Stereo Microscope Unit (optional) |
15x to 100x, Binocular/Trinocular |
15x to 100x, Binocular/Trinocular |