KDF now offers an enhanced level of system automation and cleanliness for all 600 Series, 744, and 844i systems.
The KDF robotic load option enables fabs to more fully integrate their processes. It features a cleanroom-rated 6-axis robot capable of handling 100 mm to 300 mm wafer sizes, along with a wide variety of unique substrate shapes and sizes. For 150 mm wafers on a standard 600 Series pallet with a 1-micron Al deposition, throughput exceeds 35 WPH. For other system and substrate configurations, please consult the factory for throughput specifications.
Precise handling is achieved through a specialized wafer-positioning algorithm that ensures accurate and repeatable transfers. The robot operates within its own Class 100 clean mini-environment to further reduce particle contamination.
KDF Sputtering system robot auto wafer loading opus
Video Credit: Kurt J. Lesker Company
Design
The system can be deployed as a stand-alone unit or in a through-the-wall configuration. Its design also allows for access to the load lock area without undocking the robot. A roll-around human interface terminal is included, simplifying system maintenance.