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744i Vertical Batch-Sputtering System

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The 744i is a large-area, four-target RF/DC batch sputtering system designed for processing high-density interconnects, 200 mm semiconductor wafers, and flat panel displays.

The 744i accommodates glass sizes up to Gen 2 and includes a high-vacuum load lock with integrated substrate pre-heat, supporting the system’s high-throughput capabilities. It features a 19 x 19-inch pallet area while maintaining a compact footprint, using less than one-third the floor space of comparable equipment.

The system supports four 200 mm wafers or multiple smaller wafers and includes two processing pallets, allowing for instantaneous wafer size changes and processing of both front and backside surfaces.

The 744i can also be upgraded with scan velocity profiling. It also supports the full range of KDF-engineered cathodes, including the Magterial^™ cathode for nickel deposition. The system meets the Semiconductor S2-0706 safety specification as standard, with a CE option available for European installations. Pulsed DC sputtering up to 20 kW is supported via the Advanced Energy Pinnacle Plus.

Remote PC access allows for software upgrades and file repair over an Internet Ethernet connection. Full documentation is included and is available in standard paper, cleanroom paper, or electronic CD format. For applications requiring enhanced cleanliness or handling, the optional robotic loader is available.

744i System Highlights

Broad spectrum research tools
Large area production tools [Gen 2]
Custom system designs
Complete metrology for process development in-house
Cheapest cost of ownership and excellent uptime
R&D and production custom cluster tools

In Line with the Process

KDF develops and manufactures the industry's most dependable in-line sputtering tools. At the lowest cost of ownership in the industry, KDF's systems are all designed to satisfy high throughput requirements and adaptability across multiple industries.

Mainstream silicon
Emerging materials
Flat panel displays
Optical communications
Medical devices

Across all platforms, KDF’s in-line batch sputtering systems are easier to use and maintain than cluster tools. KDF’s solutions offer users improved:

Automation
Tool uptime
Reliability
Environmental health and safety benefits
Film uniformity
Throughput run to run
Process stability
ROI

KDF meets customer needs by rapidly developing tailored solutions, leveraging its core expertise to address specific goals such as increased throughput, improved ROI, or faster time to market. All existing KDF equipment is fully supported with available upgrades and retrofits.

Additionally, as the OEM for MRC batch systems, KDF provides comprehensive global support for all MRC batch products, including complete parts and service coverage.

744i Vertical Batch-Sputtering System

Image Credit: Kurt J. Lesker

744i Series

The KDF 744i Series is a large-area, four-target batch sputtering system designed for processing high-density interconnects, 200 mm semiconductor wafers, OLEDs, and flat panel displays. The system was developed to meet growing customer demand for higher throughput with larger substrates.

Vertical side sputtering systems
19” × 19” pallet size
Compact footprint that occupies less than one-third of the area required by competitive equipment
High-vacuum loadlock with quartz heater lamps to efficiently degas substrates
Capable of processing up to four 200 mm wafers or many smaller wafers simultaneously
The throughput for 200 mm wafer metallurgy is four times higher than that of the 600i Series equipment
Glass sizes up to Gen 2
Pallet assist tool (PAT) for safely and consistently handling up to 60 lb pallet workloads
Optional OPUS Robot for particulate-free, dependable cassette-to-cassette substrate handling activities
Optional integrated RGA for process and fault monitoring of gas peaks, with integrated high-vacuum step
Optional rotating substrate pallet to meet optical industry demands

The tool features a four-target main chamber system. Pallets allow for instantaneous changes in wafer sizes and support processing on either the front or backside of the wafer.

The 744i Series is also available with an optional 20 kW DC Pinnacle Plus pulsed sputtering and pulsed bias configuration.

KDF 744i tools can be equipped with a variety of cathodes. Inset Cathodes^™, measuring 24.5 inches in length, support most metal types—including all precious metals—while offering a higher cathode-to-pallet aspect ratio and improved uniformity.

The Magterial Cathode^™, a planar-type design, is ideal for magnetron sputtering of ferrous metals such as nickel and iron, delivering high deposition rates and excellent uniformity.

Additional cathode options include the Mark II^™, which is well-suited for sputtering dielectric materials such as SiO₂ or for reactive deposition of materials like indium-tin oxide.

The Mark II^™ offers an improved magnet design, enhanced uniformity, and extended cathode life. The RF-capable KDF LMM^™ full-face erosion cathode is also available for applications requiring low particle generation.

All cathodes are modeled and designed in-house by KDF’s engineering team, drawing on customer requirements and field-proven designs. Optional gas delivery systems are available to support advanced reactive processes.

744i Vacuum Specifications

Chamber ultimate : ≤1 × 10^-7 torr
Chamber leak rate: 20 minutes to 1 × 10^-4 torr
High vacuum dome ultimate : ≤1 × 10^-7 torr
High vacuum dome leak rate: 15 minutes to 1 × 10^-4 torr
Pump down from atmosphere 110 minutes or less to 1 × 10^-6 torr or 2 × 10^-7 torr overnight

744i System Hardware Features

20kW low stored energy DC power supplies (Advanced Energy). Optional Pinnacle Plus power supplies
Automated motor-driven load lock door.
Complies with NFPA79 guidelines.
The integrated throttling SS VAT valve allows for upstream or downstream pressure control.
Loadlock linear sensor – computer controller positioning system for increased loadlock accuracy and a more limited fail-safe.
Low-pressure hydraulic system for safety and smooth operation.
MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurements.
Optional 3kW RF solid state power supply (Advanced Energy).
Process gas control with up to four gas controllers; feedback controlled capacitance manometer; master/slave gas select ability; and gas ratio control.
Stepper motor pallet carrier drive with optical encoder provides accurate programmable pallet carrier positioning, scan velocity profiling available.
Consult the factory for an extensive list of standard options.

744i Computer Sub-System

The real-time GUI is based on Windows^™ 10 and includes a 24" LCD touchscreen display installed on a transportable HI cart with an umbilical cable
Context-sensitive recipe manager that runs from a Microsoft^® SQL database
This comprehensive package includes real-time data display, logging, report production, remote interface, and printing. It is fully compatible with Excel^™, Lotus^™, and other Windows^™ programs
Connect to SECS/GEM communication and Windows^™ programs via an OPC server interface
Ethernet IP field bus and Device Net technologies are used in this distributed Rockwell control system
Complete diagnostic and manual process control capabilities are included in the maintenance test suite
Fully enclosed, service-friendly electrical cabinet