The 600i Series features dual load lock, in-line RF/DC side sputtering batch systems. These systems are available with an optional high-vacuum load lock and offer three or four target positions. The standard pallet size is 13 x 13 inches, with custom pallet designs also available.
Particularly Popular
The 600i Series is especially popular for applications involving target materials that tend to generate higher particulate contamination.
Models in this series include the 603i, 643i, 654i, and 654ix. The “ix” models feature an extended sputter area for improved process uniformity, utilizing KDF’s proprietary X-series™ cathodes. These systems also support KDF’s new LMM™ cathode, along with additional in-house cathode designs.
Versatility
The 654i and 654ix both support four-target operation. All 600i Series systems can be upgraded with scan velocity profiling and meet the Semiconductor S2-0706 safety specification as a standard feature. A CE-compliant option is available for European installations. Pulsed DC sputtering is offered via the Advanced Energy Pinnacle Plus.
Every 600i Series system includes remote PC access, enabling software updates and file repair over an Ethernet connection. Full documentation is standard and available in standard paper, cleanroom paper, or CD formats. For applications requiring heightened cleanliness and substrate handling, the optional robotic loader is available.
In Line with the Process
KDF systems are recognized as the most reliable in-line sputtering tools in the industry. They’re designed to deliver versatility and high throughput across a wide range of markets, all while maintaining a low cost of ownership.
- Mainstream silicon
- Emerging materials
- Flat panel displays
- Optical communications
- Medical devices
Compared to cluster tools, KDF’s in-line batch systems are easier to operate and maintain. They consistently deliver improvements in:
- Automation
- Tool uptime
- Reliability
- Environmental health and safety benefits
- Film uniformity
- Run-to-run throughput
- Process stability
- ROI
KDF works closely with customers to quickly develop tailored solutions built on its core competencies. Whether it’s boosting throughput, ROI, or time to market, KDF can customize its tools accordingly. Upgrades and retrofits are supported by all legacy KDF systems. As the OEM for MRC batch systems, KDF also offers global support for all MRC batch products, including parts and service.
Image Credit: Kurt J. Lesker
600i Series
603i, 643i, 643ix, 654i and 654ix
Designed for sensitive applications using both standard and particulate-prone materials, the 600i Series meets stringent requirements for thin film deposition in high-density and defect-sensitive devices.
- 13” x 13” pallet size
- Compact footprint
- Dual-process load lock
- In situ pallet optical measurement with software-based temperature control
- Multiple bias options for dense films and planarization
- Multi-size pallet support for run-to-run substrate changes
- Optional integrated RGA for gas monitoring and hivac step control
- Optional OPUS robot for clean, cassette-to-cassette handling
- Vertical side sputtering
The 600i Series supports multi-process sputtering, delivering greater process flexibility and higher throughput. Systems in the 600ix Series also feature the specialized Linear Moving Magnetron™ (LMM™) cathode. This patented cathode design is built for high-demand applications, offering robust high-rate reactive processing, full-face erosion, and minimal particle generation.
The 600i Series accommodates a range of substrate sizes, from a single 8” wafer to up to thirty-six 2” wafers. Optional gas delivery systems are available to further support advanced reactive process requirements.
603i:
The 603i is designed for sensitive applications involving target materials known to generate high levels of particulate contamination. Its base configuration includes a rough-pumped load lock, allowing for fast production exchange cycles.
Typical use cases include telecommunications manufacturing, chip resistor production, resistor networks, and a wide range of other manufacturing processes.
643i:
The 643i’s advanced mechanical and electrical design delivers tight process control, high reliability, and an exceptionally low defect rate. Building on the 603i platform, it adds a high-vacuum pumped load lock with integrated quartz heat lamps.
Key process control features include a palletized batch processing area that enables instant wafer size changes, allowing users to switch pallets from one run to the next. This flexibility supports both front- and backside GaAs wafer processing. KDF also offers an extensive pallet library with designs optimized for a wide range of application needs.
654i:
Developed for the rapidly expanding telecommunications and compound semiconductor markets, the 654i offers four-target versatility, making it ideal for a broad range of advanced microelectronic component manufacturing applications. The system delivers improved etch and deposition uniformity along with high-speed batch processing for increased productivity.
643ix and 654ix:
The 643ix and 654ix are part of KDF’s X Series™ product line, featuring the latest 17-inch extended cathode designs for enhanced uniformity across the entire pallet. X Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ configurations, as well as other configurations in the KDF cathode family.
600i Series Vacuum Specifications:
- Chamber ultimate ≤1 × 10-7 torr
- Chamber leak rate, 20 minutes to 1 × 10-4 torr
- High vacuum dome ultimate ≤1 × 10-7 torr
- High vacuum dome leak rate, 15 minutes to 1 × 10-4 torr
- Pump down from atmosphere 110 minutes or less to 1 × 10-6 torr or 2 × 10-7 torr overnight
Image Credit: Kurt J. Lesker
600i Series System Hardware Features
- 12 kW DC power supplies with low energy storage (Advanced Energy). Optional Pinnacle Plus power supplies
- The integrated throttling SS VAT valve allows for upstream or downstream pressure control
- MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum readings
- Process gas management with up to four gas controllers; feedback-controlled capacitance manometer; master/slave gas selection capability; and gas ratio control
- Stepper motor pallet carrier drive with optical encoder provides accurate programmable pallet carrier placement; scan velocity profiling is provided
- Low-pressure hydraulics system ensures safety and smooth operation
- Loadlock linear sensor - a computer-controlled positioning system that improves loadlock accuracy and limits fail-safes
- Optional 1.25 or 3.0 kW RF solid state power supply (Advanced Energ
- Complies with NFPA79 guidelines
- Consult factory for an extensive list of standard options
600i Series Computer Sub-System
- Real-time graphical user interface (GUI) environment based on Windows™ 10 and a 24-inch LCD touchscreen monitor that is attached to a mobile HI cart
- Context-sensitive recipe manager runs on Microsoft® SQL database
- This comprehensive package includes real-time data display, logging, report production, remote interaction, and printing. It is fully compatible with Excel™, Lotus™, and other Windows™ apps
- Optional access to SECS/GEM communication and Windows™ programs via OPC server interface
- Distributed Rockwell Control System with Device Net and Ethernet IP field bus technology
- Maintenance test suite with comprehensive diagnostic and manual process control capabilities
- Service friendly, fully enclosed electronic cabinet
600i Series Basic Facility Requirements
- Power: 208 VAC, 3-phase, 100 Amps.
- Water: 6.5 GPM, 70 PSIG min., 10 °C - 24 °C
- Compressed Air: 85 - 100 PSIG.
- Process Gas: 25 PSIG 99.999 %.
- Pure Gas: Dry N2