The 900i Series features dual load lock, in-line, sputter-down batch systems, configurable with an optional high-vacuum load lock and either three or four target positions.
Versatility
High-rate DC magnetron sputtering, single-pass or multi-pass deposition, and dual-level high-vacuum pumped load lock features all contribute to the versatility and high-throughput performance of these production systems. Both the cathode and wafer are oriented horizontally, enabling vertical transfer of the sputtered material.
The 900i Series systems are highly adaptable and well-suited for applications where substrate size, shape, or height presents a challenge. The 954i and 974i systems, when equipped with the tall dome option, can handle substrate heights up to 2 inches. The 974i systems also support processing of a full Gen 2.5 substrate on a 20 x 20-inch pallet, and their 200 mm wafer metallurgy throughput is four times higher than that of other 900i Series systems.
Convenience
The 900i Series systems are well-regarded for their pure metal target deposition and easy wafer-to-pallet loading. The series includes the 903i, 943i, 943ix, 954i, 954ix, and 974i models. The 954i, 954ix, and 974i systems support up to four target positions.
The ix series models feature an extended sputter area for improved process uniformity, using KDF’s “X-series”™ cathodes. They also support KDF’s latest LMM™ cathode, along with other custom cathodes developed by KDF’s in-house design team. All systems in the 900i Series can be further enhanced with KDF’s proprietary ERPP™ and scan velocity profiling capabilities.
In Line with the Process
KDF develops and manufactures the industry's most reliable in-line sputtering tools. KDF's systems are all designed to fulfill adaptability and high throughput demands in a variety of sectors while maintaining the industry's lowest total cost of ownership.
- Optical communications
- Medical devices
- Mainstream silicon
- Emerging materials
- Flat panel displays
Across all platforms, KDF’s in-line batch sputtering systems are easier to operate and maintain compared to cluster tools. KDF’s solutions offer users increased:
- Automation
- Tool uptime
- Reliability
- Environmental health and safety benefits
- Film uniformity
- Throughput run to run
- Process stability
- ROI
KDF meets customer needs by quickly developing tailored solutions and building on its core competencies. Its tools can be specifically engineered to boost throughput, ROI, or time to market. All existing KDF equipment is supported with upgrades and retrofits. Additionally, as the OEM for MRC batch systems, KDF provides full parts and service support for all MRC batch products worldwide.
Image Credit: Kurt J. Lesker Company
900i Series
903i, 943i, 943ix, 954i and 954ix
Designed to meet today’s stringent production requirements, the 900i Series offers process flexibility typically found in R&D systems. It exceeds the standards for thin film deposition in application-critical devices and other uses where maximum uniformity is essential.
- 12” x 12” substrate area
- Capacity to process dimensional substrates up to 1.5” thick
- Capacity to process up to one 300 mm wafer or multiple smaller wafers at a time
- Convenient wafer to pallet loading ability
- Horizontal cathode and substrate orientation for gentle substrate fixturing and varied substrate sizes
- High-rate DC magnetron sputtering and single/multiple-pass deposition features
- Optional hardware allows for 2” thick substrates
- Optional planetary substrate pallet for unsurpassed film uniformity
- Optional high vacuum loadlock configuration with quartz heater lamps for efficient degassing of substrates
- Optional integrated RGA for process fault monitoring of gas peaks along with integrated hi vac step
The 900i Series systems can be equipped with KDF’s exclusive Enhanced Rotary Planetary Pallet (ERPP™), which significantly improves wafer uniformity. When used with KDF’s cathodes, this option delivers better than ±1 % uniformity across the pallet and better than 0.5 % repeatability between runs for dielectrics such as SiO2 and TiO2—compared to the traditional ±15–20 % uniformity range for these materials.
For specialized applications, the patented LMM™ Cathode is engineered for efficiency in high-demand environments, offering high-rate reactive processing, full-face erosion, and minimal particle generation. Optional gas delivery systems can further enhance reactive process performance.
903i
The 903i is targeted at contact metallurgy processing, offering pure metal target deposition and convenient wafer-to-pallet loading for sputter-down applications. Its rough-pumped load lock enables fast production exchange cycles, making it ideal for high-throughput environments.
943i
Building on the 903i platform, the 943i adds a high-vacuum pumped load lock equipped with quartz heat lamps. It's well-suited for producing application-critical thin films used in hybrid circuits for defense, aerospace, and space telecommunications—applications that demand repeatable, high-throughput processes with excellent uniformity.
954i
The 954i is designed for processing GaAs and other compound semiconductor materials. It features a four-target batch sputtering configuration capable of both frontside and backside deposition, maximizing utilization, cost-effectiveness, and overall productivity.
943ix and 954ix
The 943ix and 954ix are part of KDF’s x Series™ product line. These systems incorporate the latest KDF cathode designs, extended to 17 inches for improved uniformity across the full pallet. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ configurations.
900i Series Vacuum Specifications
- Chamber ultimate ≤1 × 10–7 torr
- Chamber leak rate: 20 minutes at 1 × 10–4 torr
- Maximum vacuum dome pressure ≤1 × 10–7 torr
- High vacuum dome leak rate (15 minutes to 1 × 10–4 torr)
- Pump from atmospheric pressure in 110 minutes or less to 1 × 10–6 torr or 2 × 10–7 torr overnight
- Load-lock high vacuum pressures with the CTI-8 cryo pump
Image Credit: Kurt J. Lesker Company
900i Series System Hardware Features
- 1.25 kW/RF solid state power supply (Advanced Energy).
- 12 kW low stored energy DC power supplies (Advanced Energy). Optional Pinnacle Plus power supplies.
- Complies with NFPA79 guidelines
- Fully automated self locking top plate support system
- Integrated throttling SS VAT valve allowing for upstream or downstream pressure control.
- MKS multi component “Smart” 390 and 925 gauges for integrated vacuum measurements
- Optional Pallet Stacker replaces dual pallet shelf load-lock with 6 shelf hanger that allows for 5 pallet sequential operation.
- Low pressure hydraulics system for safety and smooth operation.
- Loadlock linear sensor – computer controller positioning system for increased loadlock accuracy and more limited fail-safe.
- Process gas control with up to four gas controllers; feedback-controlled capacitance manometer; master/slave gas select ability; and gas ratio contro
- Stepper motor pallet carrier drive with optical encoder providing accurate programmable pallet carrier positioning, scan velocity profiling available.
- Consult factory for an extensive list of standard options.
900i Series Computer Sub-System
- Context sensitive recipe manger running out of Microsoft® SQL database.
- Fully integrated package for real-time data display, data logging fully compatible with Excel™, Lotus™ and other Windows™ applications, report generation, remote interface and printing.
- Optional connectivity to SECS/GEM communication and Windows™ applications through and OPC server interface.
- Distributed Rockwell Control System utilizing Device Net and Ethernet IP field bus technologies.
- Maintenance test suite with full diagnostic and manual process cont rol capability.
- Service-friendly, fully enclosed electronic cabinet.
- Windows™ 10-based real-time GUI environment, coupled with 24” LCD touchscreen monitor mounted on an umbilicaled mobile HI cart
900i Series Basic Facility Requirements
- Compressed Air: 85 - 100 PSIG.
- Process Gas: 25 PSIG 99.999 %.
- Pure Gas: Dry N2
- Power: 208 VAC, 3-phase, 100 Amps.
- Water: 6.5 GPM, 70 PSIG min., 10 °C – 24 °C
974i Series
Designed to meet today’s stringent production requirements, the 974i Series offers the process flexibility typically found in R&D systems. It exceeds the standards for thin film deposition in application-critical devices and other applications where maximum uniformity is essential.
- 20” x 20” substrate area.
- Capacity to process up to one Gen 2.5 substrate on the pallet.
- Capacity to process dimensional substrates up to 2” thick.
- High vacuum loadlock with quartz heater lamps for efficient degassing of substrates.
- Horizontal cathode and substrate orientation for gentle substrate fixturing and varied substrate sizes.
- High-rate DC magnetron sputtering and single / multiple-pass deposition features.
- Throughput for 200mm wafer metallurgy is increased four times over that of a 900i Series system.
- Optional planetary substrate pallet for unsurpassed film uniformity.
- Optional integrated RGA for process and fault monitoring of gas peaks along with integrated hi vac step.
The 974i Series systems can be equipped with KDF’s exclusive Enhanced Rotary Planetary Pallet (ERPP™), which significantly improves wafer uniformity. When paired with KDF’s cathodes, this pallet option achieves better than ±1 % uniformity across the pallet and repeatability better than 0.5 % between runs for dielectrics such as SiO2 and TiO2—far exceeding the traditional ±15–20 % range for these materials.
For specialized applications, the 974i Series also offers KDF’s Focest Cathode™, originally developed for high-aspect ratio deep trench fills. This cathode improves uniformity, deposition rate, and material utilization.
The 974i is targeted at contact metallurgy processing, offering pure metal target deposition and straightforward wafer-to-pallet loading for sputter-down applications.
It is ideally suited for producing application-critical thin films used in hybrid circuits for defense, aerospace, and space telecommunications. These applications demand high-throughput, repeatable processes with consistently uniform films.
Designed to handle GaAs and other compound semiconductor materials, the 974i is a four-target batch sputtering tool that supports both frontside and backside deposition, maximizing utilization and enhancing cost-effectiveness.
The 974i also features KDF’s latest cathode designs, extended to 24.5 inches to improve uniformity across the entire pallet. Cathodes are available in Planar™, Inset™, and RF/DC LMM™ configurations.
974i Series Vacuum Specifications
- Chamber ultimate ≤1 × 10-7 torr.
- Chamber leak rate, 20 minutes to 1 × 10–4 torr
- High vacuum dome ultimate ≤1 × 10–7 torr
- High vacuum dome leak rate, 15 minutes to 1 × 10–4 torr
- Pump down from atmosphere 110 minutes or less to 1 × 10–6 torr or 2 × 10–7 torr overnight
- Load-lock high vacuum pressures with the CTI-8 cryo pump
Image Credit: Kurt J. Lesker Company
974i Series System Hardware Features
- 20 kW low stored energy DC power supplies (Advanced Energy). Optional Pinnacle Plus power supplies.
- Complies with NFPA79 guidelines.
- Consult the factory for an extensive list of standard options.
- Fully automated self locking top plate support system.
- Integrated throttling SS VAT valve allowing for upstream or downstream pressure control.
- Loadlock linear sensor – computer controller positioning system for increased loadlock accuracy and more limited fail-safe.
- Low pressure hydraulics system for safety and smooth operation.
- MKS multi component “Smart” 390 and 925 gauges for integrated vacuum measurements.
- Optional 3 kW/RF solid state power supply (Advanced Energy).
- Process gas control with up to four gas controllers; feedback controlled capacitance manometer; master/slave gas select ability; and gas ratio control.
- Stepper motor pallet carrier drive with optical encoder providing accurate programmable pallet carrier positioning, scan velocity profiling available.
974i Series Computer Sub-System
- Context-sensitive recipe manager running out of Microsoft® SQL database.
- Distributed Rockwell Control System utilizing Device Net and Ethernet IP field bus technologies.
- Fully integrated package for real-time data display, data logging fully compatible with Excel™, Lotus™ and other Windows™ applications, report generation, remote interface and printing.
- Maintenance test suite with full diagnostic and manual process cont rol capability.
- Optional connectivity to SECS/GEM communication and Windows™ applications through and OPC server interface.
- Windows™ 10-based real-time GUI environment, coupled with 24” LCD touchscreen monitor mounted on an umbilicaled mobile HI cart
- Service-friendly, fully enclosed electronic cabinet.
974i Series Basic Facility Requirements
- Process Gas: 25 PSIG 99.999 %
- Pure Gas: Dry N2
- Power: 208 VAC, 3-phase, 100 Amps
- Water: 6.5 GPM, 70 PSIG min., 10 °C – 24 °C
- Compressed Air: 85 - 100 PSIG