The 844i series is a large-area, four-target RF / DC batch sputtering machine that can process high-density interconnects, 300 mm semiconductor wafers, solar photovoltaic cells, and flat panel displays.
The 844i can support glass sizes up to Gen 3. Because of its size, it is particularly cost-effective when it comes to running batches of tiny to big wafers or substrates.
The 844i features a high-vacuum load lock with substrate pre-heat, allowing for the tool's high throughput. Its pallet area is also 26.5 x 30 inches with a small, compact footprint, taking up less than one-third of the floor space of competitive equipment.
The tool can hold four 300 mm wafers or multiple smaller wafers and features two processing pallets, allowing for the instantaneous change of wafer sizes and the ability to process both the front and backsides of wafers.
Safety Specs
The 844i system can be enhanced with scan velocity profiling and meets the Semiconductor S2-0706 safety specification as part of its standard configuration. A CE-compliant option is also available for European installations. For pulsed DC sputtering, the system supports up to 20 kW through the Advanced Energy Pinnacle Plus.
Remote PC access is included, allowing for software upgrades and file repair via an Internet Ethernet connection. Comprehensive documentation is provided in standard paper, cleanroom paper, or electronic CD format. For applications requiring elevated cleanliness or precision handling, the optional robotic loader is available.
In Line with the Process
KDF develops and manufactures the industry's most reliable in-line sputtering tools. KDF's systems are all designed to fulfill adaptability and high throughput demands in a variety of sectors while maintaining the industry's lowest total cost of ownership.
- Mainstream silicon
- Emerging materials
- Flat panel displays
- Optical communications
- Medical devices
On all platforms, KDF's in-line batch sputtering systems are simpler to use and manage than cluster tools. KDF's products provide users with increased:
- Automation
- Tool uptime
- Reliability
- Environmental health and safety benefits
- Film uniformity
- Film uniformity
- Throughput run to run
- Process stability
- ROI
KDF meets customer needs by rapidly developing tailored solutions, leveraging its core competencies to address specific performance goals. Tools can be custom-engineered to boost throughput, improve ROI, or accelerate time to market.
All existing KDF equipment is fully supported with available upgrades and retrofits. Additionally, as the OEM for MRC batch systems, KDF provides complete global parts and service support for all MRC batch products.
Image Credit: Kurt J. Lesker
844i Series
The KDF 844i Series is a large-area system designed to meet the demanding process requirements of high-density interconnects, 300 mm semiconductor wafers, OLED, and flat panel display manufacturing.
The all-new second-generation 844i features an increased pallet size to support higher throughput with larger substrates, along with improvements such as a reduced footprint and upgrades to both hardware and software.
- Vertical side sputtering systems
- 26.5” × 30” pallet size
- Compact footprint that occupies less than one-third of the area required by competitive equipment
- Dual-process high-vacuum loadlock
- Capable of processing up to four 300 mm wafers or many smaller wafers simultaneously
- The throughput for 300 mm wafer metallurgy is four times higher than that of the 600i Series equipment
- Glass sizes up to Gen 3.5
- Pallet assist tool (PAT) for safely and consistently handling up to 100 lb pallet payloads
- The through-the-wall design provides for clean room compatibility
- Optional OPUS Robot intended for dependable, particle-free cassette-to-cassette substrate handling operations
The tool features a four-target main chamber system. Pallets allow for instantaneous changes in wafer sizes and enable processing on either the front or back side of the wafer.
The all-new 844i Series system has been completely redesigned, now offering three-door front access to the main chamber. It is equipped with dual CTI 10 cryo pumps, which can be coupled with an optional CTI isolated water pump for maximum pumping performance.
Targets on the 844i Series are available in a variety of high-efficiency formats. The system offers a target utilization rate of up to 60 %. All cathodes are modeled and designed in-house by KDF’s engineering staff, based on both customer input and field-proven performance. Optional gas delivery systems are available to support enhanced reactive processes.
The KDF 844i tools can be fitted with a variety of cathodes. KDF Inset Cathodes™, up to 30.5 inches in length, support most metal types and all precious metals. The system features an improved cathode-to-pallet aspect ratio.
The Magterial Cathode™, a planar-type cathode, is designed for magnetron sputtering of ferrous metals such as nickel and iron, providing high deposition rates and uniformity. KDF’s latest patented LMM™ cathode, along with an optional RF version, is also available for the 844i System, offering full-face erosion for low-particle applications.
844i Vacuum Specifications
- Chamber ultimate, <9.0 × 10-8 torr
- Chamber leak rate, 25 minutes to 1 × 10-4 torr
- High vacuum dome ultimate < 9.0 × 10-8 torr
- High vacuum dome leak rate, 15 minutes to 1 ×10-4 torr
- Pump down from atmosphere 110 minutes or less to 1 × 10-6 torr or 1.0 × 10-7 torr overnight
844i System Hardware Features
- 20kW low stored energy DC power supplies (Advanced Energy).
- Complies with NFPA79 guidelines.
- Fully shielded chamber allowing for faster chamber cleaning and less clean room contamination.
- Integrated dual throttling SS VAT valves allowing for upstream or downstream gas pressure control.
- Loadlock linear sensor - computer-controlled positioning system for increased loadlock accuracy and more limited fail-safe.
- Low-pressure hydraulic system for safety and smooth operation.
- MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement.
- Process gas control with up to four gas controllers; feedback controlled capacitance manometer; master/slave gas select ability; and gas ratio control.
- Stepper-driven automated Load lock door.
- Stepper motor pallet carrier and shutter drive with optical encoder providing accurate programmable pallet carrier shutter positioning, scan velocity profiling available.
- Consult the factory for an extensive list of standard options.
Image Credit: Kurt J. Lesker
844i Computer Sub-System
- Context-sensitive recipe manager running on a Microsoft® SQL database.
- Distributed Rockwell Control System utilizing Device Net and Ethernet IP field bus technologies
- Fully integrated package for real-time data display, data logging fully compatible with Excel™, Lotus™ and other Windows™ applications, report generation, remote interface and printing.
- Maintenance test suite with full diagnostic and manual process control capability.
- Optional connectivity to SECS/GEM communication and Windows™ applications through an OPC server interface.
- Service-friendly, fully enclosed electronic cabinet.
- Windows™ 10-based real-time GUI environment, coupled with a 24” LCD touchscreen monitor mounted on an umbilical mobile HI cart.
844i Basic Facility Requirements
- Process Gas: 25 PSIG 99.999 %
- Pure Gas: Dry N2
- Power: 208 VAC, 3-phase, 225 Amps
- Water: 8 GPM, 70 PSIG min., 10 °C – 24 °C.
- Compressed Air: 85 - 100 PSIG