Oxford Instruments

Unlocking Polymeric Materials Using NMR

Using Benchtop NMR to Detect Adulteration of Arabica Coffee with Robusta

Using EBSD to Reconstruct Illegible Serial Numbers on Crystalline Materials

Combining Electron BackScatter Diffraction with EDS to Differentiate Compounds with Similar Crystal Structures

Analyzing Highly Insulating Ceramics

Li-Ion Battery Production Application Highlight - Identifying Contamination

Determining Particle Size with a Table Top Microscope

Preparing a TEM Lamella for Fast Backside Thinning Using the OmniProbe 400

SEM to Study Li-Ion Battery Materials

Validating the Technical Cleanliness of Ball Bearings

Stable Perovskite Solar Cells with Atomic Layer Deposition (ALD)

Production of Indium Phosphide (InP) Laser Diode Devices

Using THz Spectroscopy for Non-Destructive Electrical Characterization of Plasma Atomic Layer Deposited (ALD) TiN

Using GaAs Based VCSELs for the High Yield Manufacturing of Mesas

Using Benchtop NMR to Determine Grease Content in Water Quality Monitoring

Indium Phosphide (InP) Laser Diode Device Production - Maximising Performance with Plasma Deposition

Indium Phosphide (InP) Laser Diode Device Production - Defining the Mesa

How to Achieve High Yield Manufacturing of Mesas in GaAs Based VCSEL

Characterization of the c-Si/Al2O3 Interface with the Nonlinear Optical Technique of SHG Spectroscopy at Temperatures between 4 K up to 300 K

Make Overburden Studies Routine

Measuring Plasticizer Content in Polyvinyl Chloride (PVC)

Characterizing Complex Rock Samples with EBSD

Rapid Characterization of Deformed Quartz Rocks

Symmetry® - High Angular Resolution at High Speeds

Comprehensive EBSD Study of a Bivalve Shell

Fast and Effective EBSD Mapping of Martensitic Stainless Steel

Characterizing Microstructures in Steel and Ni at High Speeds

Optimizing Atomic Layer Etch (ALE) Processes Using Optical Emission Monitoring

PEALD of TiN Using the Metal Organic Precursor TDMAT for Lower Resistivity Compared Equivalent Process Conditions

The Rise of 2-Dimensional Materials

Galvanic Anodes for Cathodic Protection: Analysis with the FOUNDRY-MASTER Xpert

Using Plasma Etching to Micromachine Silicon Structure on Thin Membranes

Manufacturing of X-Ray Lenses with the Application of Bosch™ Deep Silicon Etch

Generating Orientation Maps to Present EBSD Data

Acquiring Data Using EBSD

Developments in EBSD

An Introduction to EBSD

Particle Analysis in Geology, Pollution and Wear Analysis with Energy Dispersive Spectroscopy

Atomic Layer Deposition (ALD) for Controlled Deposition of Dielectric Materials in Complex Device Structures

CVD for the Synthesis and Production of Graphene and Other 2D Materials

A Fast Micro and Nano-Structuring Method with a High Dimensional Stability Using Ga+ Resistless Lithography (GaRL)

Advancements in Inductively Coupled Plasma Chemical Vapour Deposition (ICPCVD) with a Focus on Temperature-Sensitive Devices

Large Area EDS Mapping - Phase Distribution in Archaeological Samples

Characterizing Aluminium Alloy and its Inter-Metallic Phases Using EDS (Energy-Dispersive X-Ray Spectroscopy)

EBSD Characterization of Industrial Materials after Ion Milling

Mineral Liberation Analysis in Conventional SEM with INCAMineral

Phase Characterization of Igneous Rock Using AutoPhaseMap Module of AZtecEnergy

EBSD Analysis of Grain Structure Changes During Isothermal Heating of an Aluminum Alloy

Determining Distribution of Creep Damage in Materials Using EBSD Characterization

EBSD Characterization of Hydrides in Zirconium Alloys for Nuclear Applications

Forescattered Image Acquisition with EBSD Detection for Grain Structure Analysis

Finding a Viable Processing Method for Graphene and Other 2D Materials

Controlling Beam Shape and Collimation for Contamination Reduction in Ion Beam Sputter Deposition

Using Plasma Etching on the Nanoscale

Advancing Process Capabilities of Magnetron Sputter Tools

Studying Mixtures of the Novel Gases and Photoresist Masked Silicon-Based Dielectric Etching

Deep Silicon Etch Applications in MEMS and NEMS

Coating High-Power Semiconductor Lasers (Laser Diode Bars) Facets Via Ion Beam Deposition

Computer Modeling of an ICP Machine Design

Formation of Silicon Nanoparticles via Post Deposition Annealing for Thin-Film Solar Cells

Processing Multiple Compound Semiconductor Wafers Using ICP

Ion Beam Etching

Nanoscale Etching in Inductively Coupled Plasmas

Determination of Xylene Soluble in Polypropylene Using NMR

Determination of Oil Content of Wax Using NMR

Determination of Mineral Oil Content in Crystal Polystyrene Using NMR

Deposition of High Quality Films by the Inductively Coupled Plasma CVD Process

Comparison of the Bosch and Cryogenically Cooled Deep Silicon Etch Processes

Ion Beam Deposition – Applications and Advantages

The Importance of Maintaining Research and Development Tools

Production of High Efficiency Solar Cells Using ICPCVD and PECVD

High Brightness LEDs – Large Batch Tool for GaN Etching of HBLEDs

NMR - Nuclear Magnetic Resonance in Core Analysis

Capillary Pressure Measurement in the Oil Exploration Industry Using NMR

NMR Core Analysis in the Oil Exploration Industry

Determination of Hydrogen Content in Fuels Using a Benchtop NMR

Determination of Fat Content in Foods Using a Benchtop NMR

Determination of Polybutadiene Rubber Content in Impact Polystyrene Using a Benchtop NMR

Determination of Wax Content in Oils Using a Benchtop NMR

Dramatically Reducing the Calibration Traceability Chain

Announcing the New Jupiter XR Large-Sample AFM from Asylum Research

Oxford Instruments announces Dr Philip Moll as the winner of the 2018 Nicholas Kurti Science Prize for Europe

High Volume Semiconductor Device Manufacturers choose Oxford Instruments Plasma Technology for “Lab to Fab” Solutions

New era in high field superconducting magnets – opening new frontiers in science, nanotechnology and materials discovery

Oxford Instruments Now Offers Paramount Process Facilities in Asia

Announcing the Successful Industrial Feasibility Test of a Turnkey Quantum Hall System for Graphene Characterisation and Primary Resistance Metrology

Oxford Instruments - Company Presentation

Capabilities Overview of Oxford Instruments

Overview of Oxford Instruments Strategy

Oxford Instruments Corporate Video

Periodic Table app for Plasma Etch & Deposition processes from Oxford Instruments

Semiconductor Device Fabrication from Oxford Instruments

Fastest Remote Plasma Production ALD on the Market - Atomfab

MQ-Auto Provides Sample Automation for Oxford Instruments’ MQC+ Benchtop NMR Analyzers

P5 Cells for Overburden Studies

AZtecFeature Particle Analysis System

Ultim Extreme for Ultra-High-Resolution SEM

C-Swift CMOS Detector for Materials Analysis and High-Throughput Sample Characterization

AZtecLive and Ultim Max: Combining Technologies to Revolutionize EDS Analysis

Pulsar - Benchtop NMR Spectrometer

GeoSpec2+ Industry Standard NMR Core Analyzer

GeoSpec 12 MHz Core NMR Analyzer

MQR TD-NMR Research System

MQC+ Benchtop NMR Analyzer

The OptistatDry TLEX - Versatile Cryofree® Top Loading Cryostat Designed for Different Spectroscopy Experiments

OptistatDry: Temperature Controlled Sample-in-Vacuum Measurement Environments for Spectroscopy

Optical Cryostats from Oxford Instruments

High Performance CVD System - Nanofab

Compact Open Load ICPCVD System - PlasmaPro 80 ICPCVD

Compact Open Load PECVD System: PlasmaPro 80 PECVD

Compact Open Load ICP Etch System: PlasmaPro 80 ICP

Large Batch Open Load PECVD System: PlasmaPro 800 PECVD

Load Locked or Cassette PECVD System: PlasmaPro 100 PECVD

Load Locked or Cassette ICPVD System: PlasmaPro 100 ICPCVD

Load Locked or Cassette ICP Etch System: PlasmaPro 100 Cobra

Load Locked or Cassette RIE System: PlasmaPro 100 RIE

Large Batch PECVD System: PlasmaPro 1000 Stratum

Plasma & Thermal ALD System: FlexAL

Load Locked or Cassette ICP Single Wafer Etch System: PlasmaPro 100 Polaris

Load Locked or Cassette Deep Silicon Etch System: PlasmaPro 100 Estrelas

Large Batch Open Load RIE System: PlasmaPro 800 RIE

Compact Open Load RIE System: PlasmaPro 80 ICPCVD

Ion Beam Etch System: IonFab 300 IBE