T-Pad 6500: An Electrically Insulating Thermal Interface Pad

T-Pad® 6500 is a non-silicone thermal interface material with 6.5 W/mK conductivity and a dielectric constant of 3.1 @1MHz. It stays stable across a wide range of temperatures, delivering both thermal efficiency and electrical isolation.

Soft and compliant, T-Pad® 6500 fills air gaps for maximum heat transfer. When mounted to a chassis or heatsink, its cold-flow action ensures reliable performance in rugged or silicone-sensitive applications.

T-Pad 6500 – A0 – 0.1 mm | Universal Science

SKU: 93002

Electrical Insulators, Electrically Insulating TIM, Thermal Interface, Thermally Conductive

  • Strong and reliable application, while also soft and compliant to minimize interfacial thermal resistance
  • Excellent thermal performance and high dielectric strength
  • Thermal conductivity of 6.5 W/mK
  • No adhesive

T-Pad 6500 – A0 – 0.2 mm | Universal Science

SKU: 93451

Electrical Insulators, Electrically Insulating TIM, Thermal Interface, Thermally Conductive

  • Superior dielectric strength and thermal performance
  • Thermal conductivity of 6.5 W/mK
  • Although robust and powerful in its application, the T-Pad is soft and pliable to reduce interfacial thermal resistance

T-Pad 6500 – A1 – 0.2 mm | Universal Science

SKU: 93452

Electrical Insulators, Electrically Insulating TIM, Thermal Interface, Thermally Conductive

  • Superior thermal performance and dielectric strength
  • Durable and robust in its use, yet soft and pliable to reduce interfacial thermal resistance
  • Thermal conductivity of 6.5 W/mK
  • A1 – Adhesive layer on one side

T-Pad 6500 – A2 – 0.2 mm | Universal Science

SKU: 94286

Electrical Insulators, Electrically Insulating TIM, Thermal Interface, Thermally Conductive

  • Flexible and compliant to reduce interfacial thermal resistance, yet durable and robust in application.
  • Exceptional thermal performance and dielectric strength
  • Thermal conductivity of 6.5 W/mK
  • A2 – Adhesive layer on both sides

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