The UniShield 6500 was developed in-house by Universal Science. It is designed to remove unwanted radio frequency interference (RFI). It also removes unwanted electrical coupling. This coupling can occur between high switching devices and heatsinks.
The UniShield 6500 consists of a thermally conductive and electrically isolating pad. It has an embedded copper foil laminated inside. The copper within the UniShield 6500 acts as a Faraday shield, removing RFI. Simultaneously, it acts as an excellent heat spreader.
Benefits
- Serves as an RFI shield that effectively removes unwanted electrical coupling and prevents the heatsink from acting as an antenna
- Provides a high thermal conductivity of 6.5 W/mK
- This is an electrically isolating thermal interface material that incorporates a copper Faraday shield internally
Features
- The product offers guaranteed electrical isolation. It also provides superb thermal conductivity
- It ensures no radio frequency interference between the device and the heatsink
Recommended Uses
- Aerospace applications
- Applicable in environments where both RFI suppression and superior heat dissipation are critical needs
Technical Data
Typical Physical Properties
Source: Materials Direct
| Property (unit) |
Test Method |
UniShield 6500 |
| Color |
Visual |
White |
| Thermal Conductivity (W/mK) (Insulator) |
ASTM D5470 |
6.5 |
| Thermal Conductivity (W/mK) (Copper Layer) |
- |
270 |
| Hardness Shore A |
ASTM D2240 |
75 |
| Thermal Impedance (°C - cm2/W @ 69 KPa) |
ASTM D5740 |
1.68 |
| Operating Temp. (°C) |
In House |
-40 to +125 |
| Flame Rating |
UL94 |
V-0 |
Electrical and Mechanical Information
Source: Materials Direct
| Property (unit) |
Test Method |
T-Pad 6500 (0.2 mm) |
| Breakdown Voltage (Volts AC) |
ASTM D149 |
>4000 |
| Dielectric Constant (@ 1 MHz) |
ASTM D150 |
3.1 |
| Volume Resistivity (Ω-cm) |
ASTM D257 |
2 x 1011 |
| Outgassing CVCM (%) |
ASTM E595 |
0.04 |
| Density (g/cc) |
- |
1.46 |
| Copper 0.1 mm thickness |
- |
Half hard tin-plated |