The Universal Science UniGap 10000NS is a high-performance, cost-effective, non-silicone thermal gap pad solution engineered for high thermal dissipation.
This thermal interface material boasts an impressive 10 W/mK thermal conductivity, which ensures it is extremely efficient at maximizing heat transfer from a component to a heatsink. This thermal gap filler achieves superb thermal performance by combining low thermal resistance values with excellent thermal wet-out properties.
It is inherently compliant and naturally tacky on both sides, making it ideal for filling micro air voids between contact surfaces. This facilitates excellent thermal transfer for demanding applications that specifically require a robust, high-performance, non-silicone thermal gap filler. This material is available in thicknesses ranging from 0.5 mm to 5 mm.
Benefits
- Devices experience low pressure due to softness
- Good thermal and electrical insulation
- An economical gap filler for efficient heat removal, which increases dependability
- Better die cutting and component stability during processing
Features
- Non-Silicone
- Soft and compliant gap filler with exceptional thermal performance
- Thermal conductivity = 10.0 W/mK
- High compressibility
Recommended Uses
- For demanding silicone-sensitive applications
- Thermally couples heat-generating electrical components to a heatsink or metalwork.
- Ideal for cooling electronics in high-performance industries like automotive and aerospace.
Technical Data
Typical Physical Properties
Source: Materials Direct
| Property (unit) |
Test Method |
UniGap 10000NS |
| Color |
Visual |
Grey |
| Thermal Conductivity (W/mK) |
Hot Disk |
10.0 |
| Hardness (Shore 00) |
ASTM D2240 |
65 |
| Operating Temp. (°C) |
- |
-40 to +125 |
| Flame Rating |
UL94 |
V-0 |
Electrical and Mechanical Information
Source: Materials Direct
| Property (unit) |
Test Method |
UniGap 8000NS |
| Thickness Tolerance (%) |
- |
± 10 |
| Volume Resistivity (Ω-cm) |
ASTM D257 |
1014 |
| Density (g/cc) |
Helium Pycnometer |
3.7 |
| Dielectric Constant @ 1 kHz |
ASTM D150 |
9 |
| Outgassing (TML %) |
ASTM E595 |
0.35 |
UniGap 10000NS™ Gap Pad – 0.5 mm | Universal Science™
Available in thicknesses from 0.5 mm to 5.0 mm (SKU: 94119-94132)
Electrically Insulating TIM, Non-silicon Gap Pad, Thermal Gap Pad, Thermal Interface
- High compressibility
- Soft and compliant gap filler with exceptional thermal performance
- Thermal conductivity = 10.0 W/ mK