Wafer XRD 200: The Solution for Wafer End Control

Wafer XRD 200

Fast, Precise, and Fully Equipped: The Solution for Wafer End Control

Wafer XRD 200 stands as an ultra-fast, high-precision automated system designed for wafer sorting based on crystal orientation and wafer geometry parameters. It comes equipped with a multitude of additional options to enhance its functionality.

Crystal Orientation Solutions: Ultra-Fast Crystal Orientation

Image Credit: Malvern Panalytical Ltd

Overview

Wafer XRD 200 is a fully automated, high-speed X-Ray diffraction platform revolutionizing wafer production and research.

It delivers crucial data on essential parameters such as crystal orientation, resistivity, geometric features (notches and flats), distance measurements, and more, all within a matter of seconds. Engineered to seamlessly integrate into the process line, Wafer XRD 200 offers unparalleled efficiency.

Features and Benefits

Ultra-Fast Precision With Proprietary Scan Technology

The method necessitates just one rotation of the wafer to collect all the essential data for a comprehensive orientation determination. This results in high precision achieved within a very brief measuring time, typically in the range of a few seconds.

Fully Automated Handling and Sorting

Engineered to enhance users’ throughput and productivity, Wafer XRD 200 features full automation for handling and sorting. With detailed data transmission tools, this device becomes a powerful and efficient element in their quality control process.

Crystal Orientation Solutions: Ultra-Fast Crystal Orientation

Image Credit: Malvern Panalytical Ltd

Easy Connectivity

The robust automation of Wafer XRD 200 is compatible with MES like SECS/GEM, allowing it to seamlessly integrate into the new or existing process.

Crystal Orientation Solutions: Ultra-Fast Crystal Orientation

Image Credit: Malvern Panalytical Ltd

High Precision, Deeper Insight

Gain unprecedented insights into the materials with the key measurements provided by Wafer XRD 200. It measures:

  • Crystal orientation
  • Notch position, depth, and opening angle
  • Diameter
  • Flat position and length
  • Resistivity

The typical standard deviation tilt (illustration: Si 100) for the Azimuthal-scan is <0.003 °, with a minimum of <0.001 °.

Wafer XRD 200 simplifies and accelerates the analysis of hundreds of potential samples, encompassing:

  • Si
  • SiC
  • Quartz
  • AlN
  • Al2O3 (sapphire)
  • LiNbO3
  • GaAs
  • BBO

Key Applications

Production and Processing

In this dynamic industry where speed is crucial, automation becomes a necessity, and the Wafer XRD 200 takes the lead as a potent solution for handling wafers, sorting, and conducting in-depth measurements.

It covers critical aspects such as crystal orientation, optical notch and flat determination, resistivity measurements, and other essential parameters. Witness the enhanced productivity firsthand.

Quality Control

Accurate and rapid comprehension of the materials is pivotal for effective quality control, and the Wafer XRD 200 stands out as the optimal solution.

Employing the ultra-fast Omega-Scan method, it discerns crystal orientation in a single measurement, it can measure up to 1 million wafers per year. With optional features, such as resistivity measurement and geometric feature determination, the Wafer XRD 200 provides unmatched efficiency and versatility for production quality control.

Materials Research

Busy environments are not limited to production settings—Wafer XRD 200 is well-equipped to offer high-throughput analysis in R&D environments.

Capable of characterizing a vast array of materials, from Si, SiC, and GaAs to quartz, LiNbO3, and BBO, the Wafer XRD 200 possesses the versatility to aid in materials research and innovation, playing a role in shaping the future of semiconductor technology.

Specifications

Source: Malvern Panalytical Ltd

. .
Throughput 10000+ Wafer per Month
Wafer geometry  On request
Tilt precision 0.003
XRD axis vs notch / flat position 0.03 °

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